The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2008
Filed:
Aug. 10, 2006
Ronald Gene Filippi, Wappingers Falls, NY (US);
Jason Paul Gill, Essex, VT (US);
Vincent J. Mcgahay, Poughkeepsie, NY (US);
Paul Stephen Mclaughlin, Poughkeepsie, NY (US);
Conal Eugene Murray, Yorktown Heights, NY (US);
Hazara Singh Rathore, Stormville, NY (US);
Thomas M. Shaw, Peekskill, NY (US);
Ping-chuan Wang, Hopewell Junction, NY (US);
Ronald Gene Filippi, Wappingers Falls, NY (US);
Jason Paul Gill, Essex, VT (US);
Vincent J. McGahay, Poughkeepsie, NY (US);
Paul Stephen McLaughlin, Poughkeepsie, NY (US);
Conal Eugene Murray, Yorktown Heights, NY (US);
Hazara Singh Rathore, Stormville, NY (US);
Thomas M. Shaw, Peekskill, NY (US);
Ping-Chuan Wang, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.