Yorktown Heights, NY, United States of America

Conal Eugene Murray

This inventor holds 88 USPTO granted patents and 7 published patent applications and 1 EPO patent, primarily in Semiconductor Devices (CPC class H01L23-5226). Top assignees: International Business Machines Corporation, Adeia Semiconductor Bonding Technologies Inc., Globalfoundries Inc.. Active years: 2004-2024.

USPTO Granted Patents = 88 

% Patents Active = 51.1


Average Co-Inventor Count = 3.2

ph-index = 13

Forward Citations = 506(Granted Patents)

Forward Citations (Not Self Cited) = 468(Dec 10, 2025)


Inventors with similar research interests:

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Company Filing History:


Years Active: 2004-2024

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Areas of Expertise:
Wafer Carcass
Alpha Particle Emission
Via Resistance
Metal Interconnect
Grain Boundaries
Contact Resistance
Hybrid Interconnects
Stacked Capacitor
Electrical Discharge
Copper Interconnects
Thermal Cycle Reliability
CMOS Device Strain
88 patents (USPTO):Explore Patents

Title: Conal Eugene Murray: Pioneering Innovations in Semiconductor Devices

Introduction:

Conal Eugene Murray, a highly accomplished inventor based in Yorktown Heights, NY, has made significant contributions to the field of semiconductor technology. With an impressive patent portfolio of 87 patents, Murray has continuously pushed the boundaries of semiconductor device design and interconnect structures. This article delves into Murray's latest patents, highlights his career achievements, explores his collaborations with industry giants, and recognizes his invaluable contributions to the field.

Latest Patents:

Murray's recent breakthrough in semiconductor design is evident in his latest patented innovations. One such patent is titled "Semiconductor Device with Reduced Via Resistance," which introduces a semiconductor interconnect structure featuring multiple bottom portions and a dielectric capping layer. By optimizing the communication between these structures, Murray's innovation helps reduce via resistance, thus improving overall device performance. This patent showcases Murray's ability to address critical challenges faced in modern semiconductor design.

Career Highlights:

Having worked extensively in the field, Murray's career is marked by numerous achievements and advancements. Murray has been associated with renowned companies such as IBM (International Business Machines Corporation) and Tessera, Inc. During his tenure, he has demonstrated a keen focus on developing cutting-edge technologies and bringing them to commercial fruition. Murray's relentless pursuit of technological innovation has positioned him as a distinguished figure in the semiconductor industry.

Collaborations:

Murray's collaborative efforts have played a vital role in his career progression and success. An example is his partnership with fellow innovators Chih-Chao Yang and Kenneth Parker Rodbell. Their combined expertise has resulted in groundbreaking advancements in semiconductor design. By collaborating with industry experts, Murray has been able to leverage diverse perspectives and tackle complex challenges more effectively, leading to novel solutions that have significantly impacted the field.

Conclusion:

Conal Eugene Murray's significant contributions to the semiconductor industry are reflected in his extensive patent portfolio, career achievements, and collaborations with industry leaders. His innovations in semiconductor interconnect structures, exemplified by his latest patents, demonstrate his commitment to advancing the field. As the world continues to rely on semiconductor technology, Murray's contributions will play an instrumental role in enhancing device performance and fueling future innovations. With a strong track record of success, Murray remains a driving force in the pursuit of cutting-edge semiconductor solutions.

Disclaimer: The information provided in this article is based on publicly available data and may not encompass all of Conal Eugene Murray's accomplishments or collaborations.

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