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Ming-Han Lee

USPTO Granted Patents = 119 (Patent Applications = 42)

Average Co-Inventor Count = 3.5

ph-index = 6

Forward Citations = 183(Granted Patents)

Forward Citations (Not Self Cited) = 166(Dec 10, 2025)

Inventors with similar research interests:

Location History:

New Taipei, TW (2023)
Taipei, TW (2015 - 2024)
Hsinchu, TW (2018 - 2024)

Company Filing History:

117 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Novatek Microelectronics Corp.

Years Active: 2015-2025

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Areas of Expertise:

Graphene Interconnect

Touch Sensing

Chemical-Mechanical Polishing

Semiconductor Packages

Integrated Circuits

Hybrid Interconnect Structures

Barrier Layers

Low-Resistance Structures

Vertical Conductive Structures

Interconnect Reliability

Diffusion Barriers

Two-Dimensional Materials

119 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12500173 - Interconnect structure with hybrid barrier layer (2025-12-16),

2. 12417981 - Semiconductor device including graphene interconnect and method of making the semiconductor device (2025-09-16),

3. 12412837 - Interconnect structure including topological material (2025-09-09),

4. 12411577 - Driver integrated circuit for touch sensing and driving method thereof (2025-09-09),

5. 12374637 - Semiconductor packages and methods for forming the same (2025-07-29),

6. 12362233 - Methods of performing chemical-mechanical polishing process in semiconductor devices (2025-07-15),

7. 12347776 - Integrated chip with graphene based interconnect (2025-07-01),

8. 12342600 - Titanium-containing diffusion barrier for CMP removal rate enhancement and contamination reduction (2025-06-24),

9. 12327760 - Interconnect structures having varied materials (2025-06-10),

10. 12315811 - Graphene barrier layer for reduced contact resistance (2025-05-27),

11. 12308282 - Interconnect structure without barrier layer on bottom surface of via (2025-05-20),

12. 12300599 - Method for forming semiconductor structure (2025-05-13),

13. 12272623 - Semiconductor packages and methods for forming the same (2025-04-08),

14. 12218060 - Integrated chip with graphene based interconnect (2025-02-04),

15. 12211799 - Semiconductor packages and methods for forming the same (2025-01-28),

Title: The Innovative Journey of Ming-Han Lee

Introduction: Ming-Han Lee, a distinguished inventor hailing from Taipei, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Lee's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology, and renewable energy solutions.

Career Highlights: With over two decades of experience in the tech industry, Ming-Han Lee has held key positions in leading research institutions and multinational corporations, driving forward cutting-edge projects and spearheading innovation.

Collaborations: Throughout his career, Lee has collaborated with top universities, research institutions, and tech companies worldwide, fostering a culture of creativity and excellence in the pursuit of technological advancement.

Conclusion: Ming-Han Lee's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the global tech community.

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