The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Nov. 20, 2019
Applicant:
Tessera, Inc., San Jose, CA (US);
Inventors:
Conal E. Murray, Yorktown Heights, NY (US);
Chih-Chao Yang, Glenmont, NY (US);
Assignee:
Tessera, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); C23F 4/00 (2006.01); C23F 1/44 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); C23F 1/44 (2013.01); C23F 4/00 (2013.01); H01L 21/76802 (2013.01); H01L 21/76805 (2013.01); H01L 21/76816 (2013.01); H01L 21/76829 (2013.01); H01L 21/76832 (2013.01); H01L 21/76834 (2013.01); H01L 21/76844 (2013.01); H01L 21/76846 (2013.01); H01L 21/76849 (2013.01); H01L 21/76897 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/5329 (2013.01); H01L 23/53223 (2013.01); H01L 23/53228 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01); H01L 23/53295 (2013.01); H01L 21/76804 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor interconnect structure that has a first portion included in an upper interconnect level and a second portion included in a lower interconnect level. The semiconductor interconnect structure has a segment of dielectric capping material that is in contact with the bottom of the first portion, which separates, in part, the upper interconnect level from a lower interconnect level. The second portion is in electrical contact with the first portion.