The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
May. 30, 2006
Jason P. Gill, Essex Junction, VT (US);
David L. Harmon, Essex, VT (US);
Deborah M. Massey, Jericho, VT (US);
Alvin W. Strong, Essex Junction, VT (US);
Timothy D. Sullivan, Underhill, VT (US);
Junichi Furukawa, Pittsburgh, PA (US);
Jason P. Gill, Essex Junction, VT (US);
David L. Harmon, Essex, VT (US);
Deborah M. Massey, Jericho, VT (US);
Alvin W. Strong, Essex Junction, VT (US);
Timothy D. Sullivan, Underhill, VT (US);
Junichi Furukawa, Pittsburgh, PA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic structure having wiring, and an associated method of designing the structure, for limiting a temperature gradient in the wiring. The electronic structure includes a substrate having a layer that includes a first and second wire which do not physically touch each other. The first and second wires are adapted to be at an elevated temperature due to Joule heating in relation to electrical current density in the first and second wires. The first wire is electrically and thermally coupled to the second wire by an electrically and thermally conductive structure that exists outside of the layer. The width of the second wire is tailored so as to limit a temperature gradient in the first wire to be below a threshold value that is predetermined to be sufficiently small so as to substantially mitigate adverse effects of electromigration in the first wire.