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Towa Corporation

USPTO Granted Patents = 81

% Expired Patents = 21.0

EPO Patents = 10

Trademarks = 13

Forward Citations = 512

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114 inventors (with patents filed for the assignee):

Michio Osada (14 out of 19 patents)

Shinji Takase (11 out of 11 patents)

Yohei Onishi (10 out of 10 patents)

4. Keiji Maeda (9 out of 10 patents)

5. Takaki Kuno (7 out of 8 patents)

6. Satoshi Kitaoka (6 out of 10 patents)

7. Kazuki Kawakubo (6 out of 6 patents)

8. Naoki Kawashima (6 out of 8 patents)

9. Makoto Matsuo (6 out of 6 patents)

10. Masataka Takehara (6 out of 6 patents)

11. Yoshihisa Kawamoto (6 out of 7 patents)

12. Yoshito Okunishi (5 out of 5 patents)

13. Nobuyoshi Koga (5 out of 7 patents)

14. Yoshinori Noguchi (5 out of 5 patents)

15. Kazuhiko Bandoh (4 out of 4 patents)

Core Competencies:

Resin Molding

Electronic Components

Sealing Methods

Molding Apparatus

Encapsulation Techniques

Compression Molding

Optical Devices

Conductive Materials

Cutting Devices

Manufacturing Methods

Low-Adhesion Materials

Polishing Apparatus

81 patents: Sort by Forward Citations

1. 12690485 - Semiconductor device manufacturing method and lead frame (2026-07-21),

2. 12611804 - Resin supply device, resin molding apparatus, and method for producing resin molded product (2026-04-28),

3. 12564986 - Compression molding die, resin molding device, resin molding system, and method for manufacturing resin molded product (2026-03-03),

4. 12564904 - Laser processing device and processed article manufacturing method (2026-03-03),

5. 12521926 - Resin molding device and method for producing resin molded article (2026-01-13),

6. 12508754 - Transfer apparatus, resin molding apparatus, and method for manufacturing resin molded product (2025-12-30),

7. 12454082 - Resin molding device and method for producing resin molded article (2025-10-28),

8. 12415302 - Conveying apparatus, resin molding apparatus, conveying method, and resin molded product manufacturing method (2025-09-16),

9. 12230512 - Resin molded product production method, molding die, and resin molding apparatus (2025-02-18),

10. 12194665 - Resin molding apparatus and method for producing resin molded product (2025-01-14),

11. 12023826 - Method for supplying resin, method for manufacturing resin molded product, and resin molding apparatus (2024-07-02),

12. 11999083 - Resin molding apparatus and method for producing resin molded product (2024-06-04),

13. 11992982 - Method for manufacturing resin molded product (2024-05-28),

14. 11981059 - Conveying apparatus and resin molding apparatus (2024-05-14),

15. 11969922 - Method for manufacturing resin molded product (2024-04-30),

TOWA CORPORATION is a leading manufacturer of advanced packaging and semiconductor equipment. With a focus on innovation and high-quality products, TOWA Corporation provides comprehensive solutions for various industries such as automotive, electronics, and telecommunications. Their expertise lies in the development and production of cutting-edge equipment for back-end processes, including assembly, testing, and inspection. By closely collaborating with customers and keeping up with technological advancements, TOWA Corporation continues to deliver state-of-the-art solutions that meet the evolving demands of the global market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

81 Patents

#49 in Kyoto 615-0031

#1,288 in Japan

#9,329 in the World

Towa Corporation

Forward Citations = 512

114 inventors:

Michio Osada (14 out of 19 patents)

Shinji Takase (11 out of 11 patents)

Yohei Onishi (10 out of 10 patents)

4. Keiji Maeda (9 out of 10 patents)

5. Takaki Kuno (7 out of 8 patents)

Please report any incorrect information to [email protected]

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