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Towa Corporation

USPTO Granted Patents = 82

% Expired Patents = 20.7

EPO Patents = 10

Trademarks = 13

Forward Citations = 512

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115 inventors (with patents filed for the assignee):

Michio Osada (14 out of 19 patents)

Shinji Takase (11 out of 11 patents)

Yohei Onishi (10 out of 10 patents)

4. Keiji Maeda (9 out of 10 patents)

5. Takaki Kuno (7 out of 8 patents)

6. Satoshi Kitaoka (6 out of 10 patents)

7. Kazuki Kawakubo (6 out of 6 patents)

8. Naoki Kawashima (6 out of 8 patents)

9. Makoto Matsuo (6 out of 6 patents)

10. Masataka Takehara (6 out of 6 patents)

11. Yoshihisa Kawamoto (6 out of 7 patents)

12. Yoshito Okunishi (5 out of 5 patents)

13. Nobuyoshi Koga (5 out of 7 patents)

14. Yoshinori Noguchi (5 out of 5 patents)

15. Kazuhiko Bandoh (4 out of 4 patents)

Core Competencies:

Resin Molding

Electronic Components

Sealing Methods

Molding Apparatus

Encapsulation Techniques

Compression Molding

Optical Devices

Conductive Materials

Cutting Devices

Manufacturing Methods

Low-Adhesion Materials

Polishing Apparatus

82 patents: Sort by Forward Citations

1. 12741402 - Method for producing resin molded product, film fixing member, liquid resin spreading mechanism and resin molding apparatus (2026-09-22),

2. 12690485 - Semiconductor device manufacturing method and lead frame (2026-07-21),

3. 12611804 - Resin supply device, resin molding apparatus, and method for producing resin molded product (2026-04-28),

4. 12564986 - Compression molding die, resin molding device, resin molding system, and method for manufacturing resin molded product (2026-03-03),

5. 12564904 - Laser processing device and processed article manufacturing method (2026-03-03),

6. 12521926 - Resin molding device and method for producing resin molded article (2026-01-13),

7. 12508754 - Transfer apparatus, resin molding apparatus, and method for manufacturing resin molded product (2025-12-30),

8. 12454082 - Resin molding device and method for producing resin molded article (2025-10-28),

9. 12415302 - Conveying apparatus, resin molding apparatus, conveying method, and resin molded product manufacturing method (2025-09-16),

10. 12230512 - Resin molded product production method, molding die, and resin molding apparatus (2025-02-18),

11. 12194665 - Resin molding apparatus and method for producing resin molded product (2025-01-14),

12. 12023826 - Method for supplying resin, method for manufacturing resin molded product, and resin molding apparatus (2024-07-02),

13. 11999083 - Resin molding apparatus and method for producing resin molded product (2024-06-04),

14. 11992982 - Method for manufacturing resin molded product (2024-05-28),

15. 11981059 - Conveying apparatus and resin molding apparatus (2024-05-14),

Towa Corporation, headquartered in Kyoto, Japan, specializes in advanced resin molding technology. The company focuses on developing innovative solutions for electronic components, utilizing various techniques such as sealing methods, molding apparatus, and encapsulation techniques. Towa's expertise extends to compression molding and the production of optical devices and conductive materials, positioning it as a key player in the resin molding industry. The organization is committed to enhancing product performance and reliability through its cutting-edge technologies.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

82 Patents

#49 in Kyoto 615-0031

#1,280 in Japan

#9,254 in the World

Towa Corporation

Forward Citations = 512

115 inventors:

Michio Osada (14 out of 19 patents)

Shinji Takase (11 out of 11 patents)

Yohei Onishi (10 out of 10 patents)

4. Keiji Maeda (9 out of 10 patents)

5. Takaki Kuno (7 out of 8 patents)

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