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Towa Corporation

USPTO Granted Patents = 76

EPO Patents = 9

Trademarks = 22

Forward Citations = 506

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101 inventors (with patents filed for the assignee):

Michio Osada (14 out of 19 patents)

Shinji Takase (11 out of 11 patents)

Yohei Onishi (10 out of 10 patents)

4. Keiji Maeda (9 out of 10 patents)

5. Takaki Kuno (7 out of 8 patents)

6. Satoshi Kitaoka (6 out of 10 patents)

7. Kazuki Kawakubo (6 out of 6 patents)

8. Naoki Kawashima (6 out of 8 patents)

9. Makoto Matsuo (6 out of 6 patents)

10. Masataka Takehara (6 out of 6 patents)

11. Yoshihisa Kawamoto (6 out of 7 patents)

12. Nobuyoshi Koga (5 out of 7 patents)

13. Yoshinori Noguchi (5 out of 5 patents)

14. Yoshito Okunishi (4 out of 4 patents)

15. Kazuhiko Bandoh (4 out of 4 patents)

Core Competencies:

Resin Molding

Electronic Components

Optical Devices

Molding Die

Compression Molding

Resin Sealing

Conductive Porous Material

Manufacturing Methods

Glove Production

Cutting Apparatus

Low-Adhesion Material

Jet Singulation

76 patents: Sort by Forward Citations

1. 12508754 - Transfer apparatus, resin molding apparatus, and method for manufacturing resin molded product (2025-12-30),

2. 12454082 - Resin molding device and method for producing resin molded article (2025-10-28),

3. 12415302 - Conveying apparatus, resin molding apparatus, conveying method, and resin molded product manufacturing method (2025-09-16),

4. 12230512 - Resin molded product production method, molding die, and resin molding apparatus (2025-02-18),

5. 12194665 - Resin molding apparatus and method for producing resin molded product (2025-01-14),

6. 12023826 - Method for supplying resin, method for manufacturing resin molded product, and resin molding apparatus (2024-07-02),

7. 11999083 - Resin molding apparatus and method for producing resin molded product (2024-06-04),

8. 11992982 - Method for manufacturing resin molded product (2024-05-28),

9. 11981059 - Conveying apparatus and resin molding apparatus (2024-05-14),

10. 11969922 - Method for manufacturing resin molded product (2024-04-30),

11. 11938660 - Mold die, resin molding apparatus, and method for producing resin molded product (2024-03-26),

12. 11833722 - Resin molding apparatus and method of manufacturing resin molded product (2023-12-05),

13. 11712823 - Molding die for compression molding with resin leakage prevention member (2023-08-01),

14. 10814532 - Resin-molding device and method for producing resin-molded product (2020-10-27),

15. 10792880 - Tableting punch or die and tableting machine including the same (2020-10-06),

TOWA CORPORATION is a leading manufacturer of advanced packaging and semiconductor equipment. With a focus on innovation and high-quality products, TOWA Corporation provides comprehensive solutions for various industries such as automotive, electronics, and telecommunications. Their expertise lies in the development and production of cutting-edge equipment for back-end processes, including assembly, testing, and inspection. By closely collaborating with customers and keeping up with technological advancements, TOWA Corporation continues to deliver state-of-the-art solutions that meet the evolving demands of the global market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

76 Patents

#38 in Kyoto 615-0031

#1,302 in Japan

#9,509 in the World

Towa Corporation

Forward Citations = 506

101 inventors:

Michio Osada (14 out of 19 patents)

Shinji Takase (11 out of 11 patents)

Yohei Onishi (10 out of 10 patents)

4. Keiji Maeda (9 out of 10 patents)

5. Takaki Kuno (7 out of 8 patents)

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