The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Sep. 29, 2021
Towa Corporation, Kyoto, JP;
Makoto Tsukiyama, Kyoto, JP;
Atsushi Morikami, Kyoto, JP;
TOWA CORPORATION, Kyoto, JP;
Abstract
A resin molding apparatus includes: a mold die that is configured to hold an object to be molded, the object including a substrate and a chip on the substrate, and that has a cavity configured to receive a resin material through a gate; a mold clamp mechanism configured to clamp the mold die; and a control section configured to control how the mold die and the mold clamp mechanism are operated, the mold die including: a movable block configured to narrow at least a portion of an internal flow path of the cavity in which internal flow path the chip is not disposed; and a driving mechanism configured to drive the movable block with use of a fluid, the control section being configured to change a driving force of the driving mechanism during resin-molding of the object.