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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11992982 B1

PDFFull Text
Date of Patent:
May. 28, 2024

Filed:

Feb. 27, 2020

Method for manufacturing resin molded product

Applicant:

Towa Corporation, Kyoto, JP;

Inventors:

Yoshito Okunishi, Kyoto, JP;

Fuyuhiko Ogawa, Kyoto, JP;

Hideyuki Sakai, Kyoto, JP;

Assignee:

TOWA CORPORATION, Kyoto, JP;

Attorney:

JCIPRNET

Primary Examiner:

Benjamin A Schiffman

Int. Cl.
CPC ...
B29C 45/02 (2006.01); B29C 33/12 (2006.01); B29C 45/14 (2006.01); B29C 45/36 (2006.01); B29C 45/40 (2006.01); B29C 45/56 (2006.01); B29C 45/64 (2006.01); B29C 45/80 (2006.01); B29C 45/37 (2006.01); B29C 45/66 (2006.01);
U.S. Cl.
CPC ...
B29C 45/02 (2013.01); B29C 33/12 (2013.01); B29C 45/021 (2013.01); B29C 45/14065 (2013.01); B29C 45/36 (2013.01); B29C 45/4005 (2013.01); B29C 45/56 (2013.01); B29C 45/64 (2013.01); B29C 45/80 (2013.01); B29C 45/14639 (2013.01); B29C 2045/14663 (2013.01); B29C 45/376 (2013.01); B29C 2045/569 (2013.01); B29C 2045/664 (2013.01);
Abstract

Provided is a resin molding apparatus that can suppress a molding problem caused by a variation in a thickness of an object to be molded or suppress a variation in a thickness of a resin molded part, and can perform a mold releasing operation. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that a height position of one mold cavity block is set using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a mold releasing operation can be performed using the one mold wedge mechanism and the one mold cavity block driving mechanism.

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