Company Filing History:
Years Active: 2024-2025
Title: Fuyuhiko Ogawa: Innovator in Resin Molding Technology
Introduction
Fuyuhiko Ogawa is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of resin molding technology, holding a total of 3 patents. His innovative approaches have led to advancements in manufacturing processes that enhance efficiency and product quality.
Latest Patents
Ogawa's latest patents include a resin molding device and a method for producing resin molded articles. The resin molding device features a lower mold for substrate placement and an upper mold with a cavity formed by a side block and a cavity block. This design allows for vertical movement and includes a clamp mechanism for securing the molds together. A transfer mechanism supplies resin material to the cavity using a plunger, while a controller manages the filling rate based on the relationship between the plunger's position and the calculated resin filling rate. The method for manufacturing resin molded products addresses issues related to variations in thickness, ensuring consistent quality and effective mold release operations.
Career Highlights
Fuyuhiko Ogawa is currently employed at Towa Corporation, where he continues to develop innovative solutions in resin molding. His work has been instrumental in improving manufacturing processes and product outcomes.
Collaborations
Ogawa collaborates with talented coworkers, including Yoshito Okunishi and Hideyuki Sakai, who contribute to the advancement of their projects and innovations.
Conclusion
Fuyuhiko Ogawa's contributions to resin molding technology exemplify his commitment to innovation and excellence in manufacturing. His patents reflect a deep understanding of the complexities involved in resin molding, making him a valuable asset in his field.