The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Nov. 12, 2021
Towa Corporation, Kyoto, JP;
Yoshito Okunishi, Kyoto, JP;
Fuyuhiko Ogawa, Kyoto, JP;
TOWA CORPORATION, Kyoto, JP;
Abstract
A resin molding device includes: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of ascending and descending vertically with respect to the side block; a clamp mechanism which clamps the lower mold and the upper mold; a transfer mechanism which supplies a resin material to the cavity by a plunger; and a controller which performs first final adjustment control for adjusting a clamp load of the clamp mechanism to a final clamp load after the cavity has been filled with the resin material supplied from the transfer mechanism and which performs second final adjustment control for driving the plunger after the first adjustment control has been completed and thereby adjusting a plunger load applied to the plunger to a final plunger load.