logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12454082 B1

PDFFull Text
Date of Patent:
Oct. 28, 2025

Filed:

Nov. 15, 2021

Resin molding device and method for producing resin molded article

Applicant:

Towa Corporation, Kyoto, JP;

Inventors:

Fuyuhiko Ogawa, Kyoto, JP;

Yoshito Okunishi, Kyoto, JP;

Assignee:

TOWA CORPORATION, Kyoto, JP;

Attorney:

JCIPRNET

Primary Examiner:

Benjamin A Schiffman

Int. Cl.
CPC ...
B29C 45/02 (2006.01); B29C 45/14 (2006.01); B29C 45/34 (2006.01); B29C 45/56 (2006.01); B29C 45/64 (2006.01); B29C 45/76 (2006.01); B29C 45/77 (2006.01); B29C 45/80 (2006.01);
U.S. Cl.
CPC ...
B29C 45/02 (2013.01); B29C 45/14639 (2013.01); B29C 45/14655 (2013.01); B29C 45/34 (2013.01); B29C 45/56 (2013.01); B29C 45/64 (2013.01); B29C 45/76 (2013.01); B29C 45/7613 (2013.01); B29C 45/7653 (2013.01); B29C 45/77 (2013.01); B29C 45/80 (2013.01); B29C 2045/14852 (2013.01); B29C 2945/76498 (2013.01); B29C 2945/76545 (2013.01); B29C 2945/76568 (2013.01); B29C 2945/76598 (2013.01); B29C 2945/76678 (2013.01); B29C 2945/76702 (2013.01); B29C 2945/76742 (2013.01); B29C 2945/76869 (2013.01);
Abstract

The resin molding device comprises: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of rising and descending vertically with respect to the side block; a clamp mechanism for clamping the lower mold and the upper mold; a transfer mechanism that supplies a resin material to the cavity by means of a plunger; and a controller that uses the relationship between the position of the plunger and a resin filling rate for the cavity calculated on the basis of the volume of a chip arranged on the substrate and the volume of the resin material when performing filling rate correspondence control for controlling operation relating to resin molding triggered as a result of the plunger arriving at a position corresponding to a predetermined resin filling rate.

Find Patent Forward Citations

Loading…