The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Mar. 21, 2024
Towa Corporation, Kyoto, JP;
Tomoyuki Goto, Kyoto, JP;
TOWA CORPORATION, Kyoto, JP;
Abstract
A method for producing a resin molded product which does not use a spreading member for spreading a resin and achieves applying a liquid resin in a short time even when an area to be applied with the liquid resin is large. The method includes: applying liquid resin () on film (), and performing resin molding with liquid resin () applied in the applying the liquid resin, wherein the applying the liquid resin includes: supplying the liquid resin () on a part of a surface of film () on a side to be applied with liquid resin (), spreading liquid resin () on a surface of a side supplied with liquid resin () in film () by folding film () supplied with liquid resin () such that the side supplied with liquid resin () be inside, and opening film () folded in the spreading liquid resin ().