The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Jun. 14, 2022
Applicant:

Towa Corporation, Kyoto, JP;

Inventors:

Syuho Hanasaka, Kyoto, JP;

Naomi Fujiwara, Kyoto, JP;

Yudai Takamori, Kyoto, JP;

Yoshito Nakamura, Kyoto, JP;

Kanji Ishibashi, Kyoto, JP;

Saori Isono, Kyoto, JP;

Assignee:

TOWA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); B23K 26/38 (2014.01); H10W 70/04 (2026.01); H10W 70/40 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 74/014 (2026.01); B23K 26/38 (2013.01); H10W 70/048 (2026.01); H10W 70/421 (2026.01); H10W 74/111 (2026.01); H10W 90/756 (2026.01);
Abstract

A lead frame has a back surface having a multiple-irradiated region that is irradiated with laser light scanned in a first scan step and laser light scanned in a second scan step, a unit resin molded product that is formed in a cutting step has corner regions overlapping the multiple-irradiated region of the lead frame, and the multiple-irradiated region prevents the laser light emitted to the back surface from reaching portions of the resin material on the front surface of the lead frame, the portions being located at a position corresponding to the corner regions.


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