Kyoto, Japan

Yudai Takamori

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Towa Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yudai Takamori. Retrieved from https://idiyas.com/inventor/yudai-takamori

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yudai Takamori: Semiconductor Manufacturing Innovation.

Introduction

Yudai Takamori is an inventor associated with Towa Corporation in Kyoto, Japan. His patent work addresses semiconductor device manufacturing and lead-frame processing. The available information lists 1 patent.

Latest Patents

Takamori’s listed patent, “Semiconductor Device Manufacturing Method and Lead Frame,” describes a lead frame with a region on its back surface that receives laser irradiation during two scanning steps. In the subsequent cutting step, the corners of each unit resin-molded product overlap this multiply irradiated region. The region is designed to prevent laser light from reaching corresponding portions of the resin material on the lead frame’s front surface, helping protect those areas during manufacturing.

Career Highlights

Takamori’s documented invention focuses on coordinating laser scanning and cutting in semiconductor device production. The approach links the lead frame’s irradiated region to the placement of molded-product corners, addressing a specific manufacturing challenge.

Collaborations

The provided information names Kanji Ishibashi and Syuho Hanasaka as Takamori’s coworkers. It does not specify their roles in the patent or describe particular collaborative work.

Conclusion

Yudai Takamori’s listed patent reflects a targeted contribution to semiconductor manufacturing, using lead-frame design and laser-processing steps to protect resin regions during production.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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