The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Nov. 22, 2021
Applicant:
Towa Corporation, Kyoto, JP;
Inventor:
Syuhei Yoshida, Uji, JP;
Assignee:
TOWA CORPORATION, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 45/26 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14008 (2013.01); B29C 45/14065 (2013.01); B29C 45/2602 (2013.01);
Abstract
The present invention enables a reference surface member to reliably contact a side surface of a recess of a molding die, and is directed to a conveyance apparatus that conveys an object to be molded to a molding die in which a recess is formed on a side of a mold surface on which the object to be molded is placed, the conveyance apparatus including: a position reference mechanism having a reference surface serving as a positioning reference of the object to be molded placed on the molding die; and an object-to-be-molded moving mechanism that moves the object to be molded placed on the molding die toward the reference surface.