The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Feb. 11, 2022
Towa Corporation, Kyoto, JP;
Ryota Nakatsukasa, Kyoto, JP;
TOWA CORPORATION, Kyoto, JP;
Abstract
The present invention provides a resin molded product production method that can reduce the molding defects even when resin-molding is performed in a state where a chip is temporarily bonded to a carrier via a temporary bonding sheet. The method for producing a resin molded product obtained by subjecting an object to be molded being a chiptemporarily bonded to a carriervia a temporary bonding sheetto transfer molding, including the step of: resin-molding the object to be molded by transfer molding using a molding die, wherein the resin-molding is performed in a state where a gap G is formed so that the temporary bonding sheetdisposed in the molding dieand a surface facing the temporary bonding sheeton a side where the chipis temporarily bonded do not come into contact with each other.