Yoshihisa Kawamoto

Title: Innovations by Yoshihisa Kawamoto

Introduction

Yoshihisa Kawamoto is a notable inventor based in Kyoto, Japan. He holds a total of seven patents, showcasing his contributions to the field of electronic component manufacturing. His innovative designs focus on improving the efficiency and effectiveness of resin molding processes.

Latest Patents

One of his latest patents is a die used for resin-sealing and molding an electronic component. This die consists of a fixed top die and a movable bottom die, featuring a surface that contacts melted resin material electroplated with a nickel-tungsten alloy. This unique plating enhances the releaseability of the resin-molded body, surpassing the capabilities of hard-chromium plating, thus allowing for efficient ejection of the molded body. Another significant patent is a method of and apparatus for molding resin to seal electronic parts. This apparatus defines an internal die space that is sealed from the exterior atmosphere when the upper and lower mold sections are closed. The die space is evacuated using a vacuum source and an instantaneous evacuation mechanism, which effectively discharges air, moisture, and gas, preventing the formation of voids in resin molded members.

Career Highlights

Throughout his career, Yoshihisa Kawamoto has worked with Towa Corporation, where he has made significant advancements in the field of resin molding technology. His expertise has contributed to the development of innovative solutions that enhance the manufacturing process of electronic components.

Collaborations

Yoshihisa has collaborated with notable individuals such as Michio Osada and Makoto Matsuo, further enriching his work and contributions to the industry.

Conclusion

Yoshihisa Kawamoto's innovative patents and career achievements highlight his significant role in advancing resin molding technology for electronic components. His work continues to influence the industry and improve manufacturing processes.