The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2004
Filed:
Nov. 02, 2000
Applicant:
Inventors:
Michio Osada, Kyoto, JP;
Keiji Maeda, Kyoto, JP;
Yoshihisa Kawamoto, Kyoto, JP;
Yoshiji Shimizu, Osaka, JP;
Toshiyuki Nishimura, Osaka, JP;
Susumu Yamahara, Osaka, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 7/072 ; B29C 4/502 ;
U.S. Cl.
CPC ...
B29C 7/072 ; B29C 4/502 ;
Abstract
A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.