Osaka, Japan

Toshiyuki Nishimura


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:

goldMedal1 out of 832,880 
Other
 patents

Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: The Innovations of Toshiyuki Nishimura

Introduction

Toshiyuki Nishimura is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electronic component manufacturing. His innovative approach has led to the development of a unique die used for resin-sealing and molding electronic components.

Latest Patents

Nishimura holds a patent for a die used for molding an electronic component with resin. This die consists of a fixed top die and a movable bottom die. It features a surface that contacts a melted resin material, which is electroplated with a nickel-tungsten alloy. This innovative plating provides superior releaseability of a resin-molded body compared to traditional hard-chromium plating. As a result, it allows an ejector pin to efficiently eject and release the resin-molded body from the die. He has 1 patent to his name.

Career Highlights

Throughout his career, Nishimura has focused on enhancing the efficiency and effectiveness of electronic component manufacturing. His work has been instrumental in improving the quality and reliability of resin-molded electronic components.

Collaborations

Nishimura has collaborated with notable colleagues, including Michio Osada and Keiji Maeda. Their combined expertise has contributed to advancements in the field of electronic component technology.

Conclusion

Toshiyuki Nishimura's innovative contributions to the electronic component industry highlight his role as a leading inventor. His patented die design showcases his commitment to improving manufacturing processes. His work continues to influence the field and inspire future innovations.

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