Susumu Yamahara

Title: The Innovative Contributions of Susumu Yamahara

Introduction

Susumu Yamahara is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electronic components through his innovative patent. His work focuses on enhancing the efficiency and effectiveness of resin-sealing and molding processes.

Latest Patents

Yamahara holds a patent for a die used for resin-sealing and molding an electronic component. This die consists of a fixed top die and a movable bottom die, which includes a surface that contacts melted resin material electroplated with a nickel-tungsten alloy. This unique plating offers superior releaseability of resin-molded bodies compared to traditional hard-chromium plating. As a result, it allows an ejector pin to efficiently eject and release the resin-molded body from the die.

Career Highlights

Throughout his career, Yamahara has demonstrated a commitment to innovation in the electronic component industry. His patent reflects his dedication to improving manufacturing processes and product quality. His work has the potential to influence the future of electronic component production significantly.

Collaborations

Yamahara has collaborated with esteemed colleagues such as Michio Osada and Keiji Maeda. These partnerships have likely contributed to the advancement of his innovative ideas and the successful development of his patent.

Conclusion

Susumu Yamahara's contributions to the field of electronic components through his innovative patent exemplify the importance of creativity and collaboration in technological advancement. His work continues to inspire future innovations in the industry.