The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Feb. 03, 2022
Applicant:
Towa Corporation, Kyoto, JP;
Inventors:
Assignee:
TOWA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/72 (2006.01); B29C 43/18 (2006.01); B29C 43/36 (2006.01);
U.S. Cl.
CPC ...
B29C 33/72 (2013.01); B29C 43/18 (2013.01); B29C 43/3607 (2013.01); B29C 2033/727 (2013.01);
Abstract
A compression molding die includes a first mold and a second mold. The first mold includes a bottom surface member and a side surface member. A space is providable in the first mold by a step of at least one of an outer peripheral surface of the bottom surface member and an inner peripheral surface of the side surface member. The first mold includes a gas inlet capable of introducing gas into the space, a gas outlet through which the gas introduced into the space is dischargeable, and a seal member below the space.