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Hsinchu, Taiwan

Super Group Semiconductor Co., Ltd.

USPTO Granted Patents = 38

% Expired Patents = 15.8

Forward Citations = 16

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14 inventors (with patents filed for the assignee):

Hsiu-Wen Hsu (28 out of 33 patents)

Chun-Ying Yeh (11 out of 17 patents)

Yuan-Ming Lee (9 out of 10 patents)

4. Chih-Cheng Hsieh (6 out of 13 patents)

5. Jen-Jun Su (4 out of 4 patents)

6. Sung-Nien Tang (4 out of 9 patents)

7. Ho-Tai Chen (3 out of 4 patents)

8. Kao-Way Tu (2 out of 11 patents)

9. Chun-Wei Ni (2 out of 2 patents)

10. Yuan-Shun Chang (2 out of 9 patents)

11. Yi-Yun Tsai (2 out of 5 patents)

12. Chung-Ming Leng (1 out of 9 patents)

13. Chih Cheng Hsieh (1 out of 2 patents)

14. Hsiu Wen Hsu (1 out of 10 patents)

Core Competencies:

Trench Power Semiconductor

Power Device

Wireless Charging

Charging Station

MOSFET

Chip Package Structure

Super-Junction Device

Fan-Out Wafer Level

Ultra-Thin Package

Power Transistor

Termination Structure

Wafer Level Chip Scale

38 patents: Sort by Forward Citations

1. 12527029 - Trench power semiconductor component and method for manufacturing the same (2026-01-13),

2. 12459388 - Charging station (2025-11-04),

3. 12451726 - Wireless charging system and its charging station (2025-10-21),

4. 12446256 - Power device and method for manufacturing the same (2025-10-14),

5. 12374659 - Power module (2025-07-29),

6. 11289587 - Trench power semiconductor component and method of manufacturing the same (2022-03-29),

7. 11142083 - Wireless charging system, wireless charging station, and vehicle (2021-10-12),

8. 11049958 - Semiconductor power device and manufacturing method thereof (2021-06-29),

9. 11049950 - Trench power seminconductor device and manufacturing method thereof (2021-06-29),

10. 10680076 - Trench power semiconductor and method of making the same (2020-06-09),

11. 10629452 - Manufacturing method of a chip package structure (2020-04-21),

12. 10559674 - Manufacturing method of a trench power semiconductor device (2020-02-11),

13. 10529847 - Trench power semiconductor component and method of manufacturing the same (2020-01-07),

14. 10516027 - Trench power semiconductor and method of making the same (2019-12-24),

15. 10497782 - Trench power semiconductor component and method of manufacturing the same (2019-12-03),

Company Overview

Super Group Semiconductor Co., Ltd. is a prominent player in the semiconductor industry, specializing in the design and manufacturing of advanced semiconductor solutions. The company focuses on developing innovative technologies for various applications, including consumer electronics, automotive systems, and industrial automation. With its headquarters in Hsinchu, Taiwan, Super Group Semiconductor is strategically positioned within a key global technology hub, enabling it to leverage regional expertise and foster collaborations in cutting-edge research and development.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

38 Patents

#112 in Hsinchu

#504 in Taiwan

#17,844 in the World

Hsinchu, Taiwan

Super Group Semiconductor Co., Ltd.

Forward Citations = 16

14 inventors:

Hsiu-Wen Hsu (28 out of 33 patents)

Chun-Ying Yeh (11 out of 17 patents)

Yuan-Ming Lee (9 out of 10 patents)

4. Chih-Cheng Hsieh (6 out of 13 patents)

5. Jen-Jun Su (4 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Super Group Semiconductor Co., Ltd.. Retrieved from https://idiyas.com/company/super-group-semiconductor-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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