The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Mar. 29, 2022
Super Group Semiconductor Co., Ltd., Hsinchu County, TW;
Jen-Jun Su, Hsinchu County, TW;
SUPER GROUP SEMICONDUCTOR CO., LTD., Hsinchu County, TW;
Abstract
A power module is provided. The power module includes an electrical interconnection assembly and at least one electronic element group. The electrical interconnection assembly includes a conductive structure and a circuit board. The conductive structure includes a first conductive member and a second conductive manner insulated from each other and arranged side by side. The circuit board is disposed on the conductive structure. The circuit board has an opening. The at least one electronic element group includes a power element that includes a first pad, a second pad, and a third pad. The first and second pads pass through the opening, and are respectively and electrically connected to the first and second conductive members. The third pad is disposed on the circuit board.