The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Mar. 20, 2020
Applicant:

Super Group Semiconductor Co., Ltd., Hsinchu County, TW;

Inventor:

Hsiu-Wen Hsu, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66734 (2013.01); H01L 29/4236 (2013.01); H01L 29/7813 (2013.01);
Abstract

A trench power semiconductor component and a method of manufacturing the same are provided. In the method, a step of forming a trench gate structure includes the following steps. First, a shielding electrode, a bottom insulating layer, and an upper insulating layer are formed in a trench. The bottom insulating layer covers a lower part of an inner wall of the trench, and surrounds the shielding electrode. The upper insulating layer covers an upper part of the inner wall. Thereafter, an interlayer dielectric layer and a U-shaped masking layer are formed in the trench. The interlayer dielectric layer is interposed between the upper insulating layer and the U-shaped masking layer. A portion of the upper insulating layer and a portion of the interlayer dielectric layer which are located at an upper part of the trench are removed so as to form an inter-electrode dielectric layer.


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