Hsiu Wen Hsu

Title: Hsiu Wen Hsu: Innovator in Semiconductor Technology

Introduction

Hsiu Wen Hsu is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His innovative approaches have advanced manufacturing methods and device structures in the semiconductor industry.

Latest Patents

Hsiu Wen Hsu's latest patents include a manufacturing method of wafer level chip scale package structure. This method involves providing a wafer with multiple semiconductor devices, forming a patterned protecting layer, and executing a wafer back thinning process. Another notable patent is the fabrication method of a trenched power semiconductor device with source trench. This method includes forming gate trenches, dielectric layers, and conductive structures to enhance device performance.

Career Highlights

Throughout his career, Hsiu Wen Hsu has worked with notable companies such as Great Power Semiconductor Corporation and Niko Semiconductor Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Hsiu Wen Hsu has collaborated with talented individuals in the industry, including Chun Ying Yeh and Chih Cheng Hsieh. These partnerships have fostered innovation and have been instrumental in the development of new technologies.

Conclusion

Hsiu Wen Hsu's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in the industry and showcases the importance of innovation in technology.