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Niko Semiconductor Co., Ltd.

USPTO Granted Patents = 78

Forward Citations = 422

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51 inventors (with patents filed for the assignee):

Ta-Ching Hsu (14 out of 14 patents)

Chih-Cheng Hsieh (12 out of 12 patents)

Hsiu-Wen Hsu (9 out of 31 patents)

4. Kao-Way Tu (9 out of 9 patents)

5. Chung-Ming Leng (8 out of 8 patents)

6. Da-Jing Hsu (6 out of 7 patents)

7. Chen-Hsung Wang (5 out of 11 patents)

8. Chung-Cheng Wu (4 out of 4 patents)

9. Hui Chiang Yang (4 out of 5 patents)

10. Chun-Ming Lin (3 out of 5 patents)

11. Hsiu Wen Hsu (3 out of 10 patents)

12. Cheng-Hui Tung (3 out of 3 patents)

13. Hui-Chiang Yang (3 out of 3 patents)

14. Shian-Sung Shiu (2 out of 58 patents)

15. Ming-Chiang Ting (2 out of 6 patents)

Core Competencies:

Power Module Package

Alternating Current Control

Brake Energy Recovery

Fan-Out Wafer Level Chip Package

LED Driving Circuit

Multiphase DC-to-DC Converter

Synchronous Rectification

High-Voltage MOSFET

Pulse Width Modulation

Chip Package Structure

Power Conversion Apparatus

Trench MOSFET Fabrication

78 patents: Sort by Forward Citations

1. 12446256 - Power device and method for manufacturing the same (2025-10-14),

2. 12424924 - Alternating current control system (2025-09-23),

3. 12400930 - Power module package (2025-08-26),

4. 12048122 - Power module and power device (2024-07-23),

5. 11387180 - Power module including a carrier assembly with combination of circuit board and lead frame (2022-07-12),

6. 10668815 - Brake energy recovery module (2020-06-02),

7. 10629452 - Manufacturing method of a chip package structure (2020-04-21),

8. 10560090 - One-way conduction device (2020-02-11),

9. 10381268 - Fan-out wafer level chip package structure (2019-08-13),

10. 10297522 - Semiconductor package structure and manufacturing method thereof (2019-05-21),

11. 10043728 - Semiconductor package structure and manufacturing method thereof (2018-08-07),

12. 9947551 - Chip package structure and manufacturing method thereof (2018-04-17),

13. 9881897 - Manufacturing method of ultra-thin semiconductor device package assembly (2018-01-30),

14. 9799563 - Fan-out wafer level chip package structure and manufacturing method thereof (2017-10-24),

15. 9537418 - Power conversion apparatus and control chip thereof (2017-01-03),

Niko Semiconductor Co., Ltd. is a leading global provider of cutting-edge semiconductor solutions. With a strong focus on innovation, we aim to deliver superior products and services that drive technological advancements across various industries. Through our advanced research and development efforts, we constantly strive to develop highly efficient and reliable semiconductors that meet the evolving needs of our customers. Our commitment to quality, customer satisfaction, and sustainable growth has earned us a strong reputation in the market. Visit our website to learn more about our comprehensive range of semiconductor solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

78 Patents

#83 in Taipei

#279 in Taiwan

#9,408 in the World

Niko Semiconductor Co., Ltd.

Forward Citations = 422

51 inventors:

Ta-Ching Hsu (14 out of 14 patents)

Chih-Cheng Hsieh (12 out of 12 patents)

Hsiu-Wen Hsu (9 out of 31 patents)

4. Kao-Way Tu (9 out of 9 patents)

5. Chung-Ming Leng (8 out of 8 patents)

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