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New Taipei, Taiwan

Niko Semiconductor Co., Ltd.

USPTO Granted Patents = 78

% Expired Patents = 57.7

Forward Citations = 427

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51 inventors (with patents filed for the assignee):

Ta-Ching Hsu (14 out of 14 patents)

Chih-Cheng Hsieh (12 out of 13 patents)

Hsiu-Wen Hsu (9 out of 33 patents)

4. Kao-Way Tu (9 out of 9 patents)

5. Chung-Ming Leng (8 out of 9 patents)

6. Da-Jing Hsu (6 out of 7 patents)

7. Chen-Hsung Wang (5 out of 11 patents)

8. Chung-Cheng Wu (4 out of 4 patents)

9. Hui Chiang Yang (4 out of 5 patents)

10. Chun-Ming Lin (3 out of 5 patents)

11. Hsiu Wen Hsu (3 out of 10 patents)

12. Cheng-Hui Tung (3 out of 3 patents)

13. Hui-Chiang Yang (3 out of 3 patents)

14. Shian-Sung Shiu (2 out of 58 patents)

15. Ming-Chiang Ting (2 out of 7 patents)

Core Competencies:

Power Module

AC Control System

MOSFET Fabrication

Synchronous Rectifier

Power Conversion

LED Driving Circuit

Trench Technology

Pulse Width Modulation

High Voltage Devices

Energy Recovery

Chip Packaging

Adaptive Control

78 patents: Sort by Forward Citations

1. 12446256 - Power device and method for manufacturing the same (2025-10-14),

2. 12424924 - Alternating current control system (2025-09-23),

3. 12400930 - Power module package (2025-08-26),

4. 12048122 - Power module and power device (2024-07-23),

5. 11387180 - Power module including a carrier assembly with combination of circuit board and lead frame (2022-07-12),

6. 10668815 - Brake energy recovery module (2020-06-02),

7. 10629452 - Manufacturing method of a chip package structure (2020-04-21),

8. 10560090 - One-way conduction device (2020-02-11),

9. 10381268 - Fan-out wafer level chip package structure (2019-08-13),

10. 10297522 - Semiconductor package structure and manufacturing method thereof (2019-05-21),

11. 10043728 - Semiconductor package structure and manufacturing method thereof (2018-08-07),

12. 9947551 - Chip package structure and manufacturing method thereof (2018-04-17),

13. 9881897 - Manufacturing method of ultra-thin semiconductor device package assembly (2018-01-30),

14. 9799563 - Fan-out wafer level chip package structure and manufacturing method thereof (2017-10-24),

15. 9537418 - Power conversion apparatus and control chip thereof (2017-01-03),

Company Overview

Niko Semiconductor Co., Ltd. is a prominent player in the power semiconductor technology sector, headquartered in New Taipei, Taiwan. The company specializes in the development and manufacturing of advanced power modules and AC control systems, focusing on enhancing efficiency in power conversion applications. Niko's expertise extends to MOSFET fabrication, synchronous rectifiers, and LED driving circuits, employing innovative trench technology and pulse width modulation techniques to deliver high-performance solutions for various electronic applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

78 Patents

#46 in New Taipei

#284 in Taiwan

#9,681 in the World

New Taipei, Taiwan

Niko Semiconductor Co., Ltd.

Forward Citations = 427

51 inventors:

Ta-Ching Hsu (14 out of 14 patents)

Chih-Cheng Hsieh (12 out of 13 patents)

Hsiu-Wen Hsu (9 out of 33 patents)

4. Kao-Way Tu (9 out of 9 patents)

5. Chung-Ming Leng (8 out of 9 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Niko Semiconductor Co., Ltd.. Retrieved from https://idiyas.com/company/niko-semiconductor-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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