The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Apr. 21, 2016
Niko Semiconductor Co., Ltd., New Taipei, TW;
Super Group Semiconductor Co., Ltd., Hsinchu County, TW;
Chih-Cheng Hsieh, Taoyuan, TW;
Hsiu-Wen Hsu, Hsinchu County, TW;
NIKO SEMICONDUCTOR CO., LTD., New Taipei, TW;
SUPER GROUP SEMICONDUCTOR CO., LTD., Hsinchu County, TW;
Abstract
A chip package structure and the manufacturing method thereof are provided. Firstly, a conductive frame including a bottom plate and a plurality of partition plates is provided. The bottom plate has a supporting surface and a bottom surface opposite thereto, and the partition plates protrude from the supporting surface to define a plurality of the accommodating regions. Subsequently, a plurality of chips is provided, and each of the chips is correspondingly accommodated in each of the accommodating regions with a back surface facing to the supporting surface. Thereafter, the conductive frame is cut to form a plurality of separated chip package structures.