Chih-Cheng Hsieh is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of power module technology, holding a total of 12 patents. His work focuses on enhancing the efficiency and functionality of power devices, which are crucial in various electronic applications.

Latest Patents

One of his latest patents is a power module package that includes an electronic assembly comprising a substrate and a power device group. This innovative package features an insulating layer, a circuit pattern layer, and a conductive heat-dissipating layer. The design ensures that the total area of the conductive heat-dissipating layer exceeds that of the circuit pattern layer, optimizing heat management. Another notable patent involves a power module and power device that includes two screws, heat dissipation components, and a substrate. This design allows for effective heat transfer during the operation of the power module, enhancing its performance and reliability.

Career Highlights

Chih-Cheng Hsieh has worked with notable companies such as Niko Semiconductor Co., Ltd. and Super Group Semiconductor Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and power modules.

Collaborations

Throughout his career, Hsieh has collaborated with talented individuals, including Hsiu-Wen Hsu and Chung-Ming Leng. These collaborations have fostered innovation and development in the field of power electronics.

Conclusion

Chih-Cheng Hsieh's contributions to power module technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in electronic devices and power management solutions.

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