The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Dec. 18, 2014
Chih-cheng Hsieh, New Taipei, TW;
Hsiu-wen Hsu, Hsinchu County, TW;
Chun-ying Yeh, Hsinchu, TW;
Chung-ming Leng, New Taipei, TW;
Chih-Cheng Hsieh, New Taipei, TW;
Hsiu-Wen Hsu, Hsinchu County, TW;
Chun-Ying Yeh, Hsinchu, TW;
Chung-Ming Leng, New Taipei, TW;
NIKO SEMICONDUCTOR CO., LTD., New Taipei, TW;
Super Group Semiconductor Co. LTD., New Taipei, TW;
Abstract
A package structure and a packaging method of wafer level chip scale package are provided. The packaging method includes: providing a carrier, and disposing a plurality of chips on the carrier; forming a plurality of adhesive layers on a surface of the corresponding chips; covering a conductive cover plate, bonding the conductive cover plate with the chips through the adhesive layers, and dividing out a plurality of packaging spaces by the conductive cover plate for disposing the chips respectively; and providing an insulation material to fill the packaging spaces through via holes on the conductive cover plate to form a first insulation structure; finally, removing the carrier.