The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2014

Filed:

Nov. 29, 2011
Applicants:

Hsiu Wen Hsu, Hsinchu County, TW;

Chih Cheng Hsieh, Taoyuan County, TW;

Inventors:

Hsiu Wen Hsu, Hsinchu County, TW;

Chih Cheng Hsieh, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor structure comprising a semiconductor unit, a first conductive structure, a first conductive plug, and a second conductive structure is provided. The semiconductor unit has a substrate on a first side of the semiconductor unit. The substrate has at least a hole. The first conductive plug is in the hole and the hole may be full of the conductive plug. The first conductive structure is on the surface of the semiconductor unit. The surface is at the first side of the semiconductor unit. The second conductive structure is on a surface at a second side of the substrate of the semiconductor unit.


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