Chih Cheng Hsieh

Title: Chih Cheng Hsieh: Innovator in Semiconductor Technology

Introduction

Chih Cheng Hsieh is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to manufacturing and design.

Latest Patents

Hsieh's latest patents include a manufacturing method of wafer level chip scale package structure. This method involves providing a wafer with multiple semiconductor devices, where an active surface features both an active region and an outer region. The process includes arranging electrodes, forming a patterned protecting layer, and performing a back thinning process, ultimately leading to the creation of a trench that exposes a back electrode layer. His second patent focuses on a semiconductor structure that comprises a semiconductor unit with a substrate featuring a hole filled with a conductive plug. This design aims to enhance the performance of semiconductor devices by reducing resistance and power consumption.

Career Highlights

Throughout his career, Hsieh has worked with prominent companies in the semiconductor industry, including Niko Semiconductor Co., Ltd. and Super Group Semiconductor Co., Ltd. His experience in these organizations has contributed to his expertise and innovative capabilities in semiconductor technology.

Collaborations

Hsieh has collaborated with various professionals in the field, including his coworker Hsiu Wen Hsu. These collaborations have likely fostered an environment of innovation and shared knowledge, further enhancing the development of new technologies.

Conclusion

Chih Cheng Hsieh is a distinguished inventor whose work in semiconductor technology has led to significant advancements. His patents reflect a commitment to innovation and efficiency in manufacturing processes. His contributions continue to influence the semiconductor industry positively.