Taichung, Taiwan

Yuan-Ming Lee

USPTO Granted Patents = 10 

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2014-2020

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10 patents (USPTO):Explore Patents

Title: Innovations of Yuan-Ming Lee

Introduction

Yuan-Ming Lee is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on the development of trench power semiconductor components and their manufacturing methods.

Latest Patents

One of his latest patents is titled "Trench power semiconductor and method of making the same." This patent describes a trench power semiconductor component that includes a substrate, an epitaxial layer, and a trench gate structure. The epitaxial layer is positioned on the substrate and features at least one trench. The trench gate structure is integrated within this trench and consists of various components, including a bottom insulating layer, a shielding electrode, a gate electrode, and an inter-electrode dielectric layer. Another notable patent is the "Manufacturing method of a trench power semiconductor device." This patent outlines a method that involves forming a protective layer on an epitaxial layer and creating a trench gate structure within a trench formed in the epitaxial layer.

Career Highlights

Yuan-Ming Lee has worked with several notable companies in the semiconductor industry, including Super Group Semiconductor Co., Ltd. and Great Power Semiconductor Corporation. His experience in these organizations has allowed him to refine his expertise in semiconductor technology and innovation.

Collaborations

Throughout his career, Yuan-Ming Lee has collaborated with talented individuals such as Chun-Ying Yeh and Hsiu-Wen Hsu. These collaborations have contributed to the advancement of semiconductor technologies and innovations.

Conclusion

Yuan-Ming Lee's contributions to the field of semiconductor technology are noteworthy, with a focus on trench power semiconductor components and their manufacturing methods. His patents and collaborations reflect his commitment to innovation in this critical area of technology.

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