The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Sep. 08, 2016
Applicant:

Super Group Semiconductor Co., Ltd., New Taipei, TW;

Inventors:

Chun-Ying Yeh, Hsinchu, TW;

Yuan-Ming Lee, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/306 (2006.01); H01L 29/66 (2006.01); H01L 29/872 (2006.01); H01L 29/06 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/404 (2013.01); H01L 21/306 (2013.01); H01L 21/30604 (2013.01); H01L 29/0619 (2013.01); H01L 29/0649 (2013.01); H01L 29/402 (2013.01); H01L 29/407 (2013.01); H01L 29/66143 (2013.01); H01L 29/8725 (2013.01); H01L 29/66348 (2013.01); H01L 29/66734 (2013.01); H01L 29/7397 (2013.01);
Abstract

A termination structure of a semiconductor device is provided. The semiconductor device includes an active area and a termination area adjacent to the active area, in which the termination area has the termination structure. The termination structure includes a substrate, an epitaxy layer, a dielectric layer, a conductive material layer and a conductive layer. The epitaxy layer is disposed on the substrate and has a voltage-sustaining region. The voltage-sustaining region has trenches parallel to each other. The dielectric layer is disposed in the trenches and on a portion of the epitaxy layer. The conductive material layer is disposed on the dielectric layer in the trenches. The conductive layer covers the trenches, and is in contact with the conductive material layer and a portion of the epitaxy layer, and is electrically connected between the active area and the termination area. A method for manufacturing the termination structure is also provided.


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