For the Inventor, By the Inventor

Enter assignee name

Munich, Germany

Siltronic Ag

USPTO Granted Patents = 302

EPO Patents = 118

Trademarks = 4

Forward Citations = 527

Loading Chart...

Loading Chart...

298 inventors (with patents filed for the assignee):

Wilfried Von Ammon (30 out of 36 patents)

Georg Pietsch (22 out of 24 patents)

Juergen Schwandner (21 out of 21 patents)

4. Reinhold Wahlich (18 out of 20 patents)

5. Katsuhiko Nakai (16 out of 16 patents)

6. Reinhard Schauer (14 out of 18 patents)

7. Thomas Buschhardt (14 out of 17 patents)

8. Martin Weber (14 out of 26 patents)

9. Michael Kerstan (13 out of 14 patents)

10. Peter Wiesner (12 out of 12 patents)

11. Peter Storck (12 out of 13 patents)

12. Timo Mueller (11 out of 11 patents)

13. Teruo Haibara (11 out of 12 patents)

14. Brian Murphy (11 out of 11 patents)

15. Andreas Sattler (10 out of 10 patents)

Core Competencies:

Silicon Semiconductor Wafers

Monocrystalline Silicon

Epitaxial Layer

Czochralski Method

FZ Method

Wire Saw Technology

Single Crystal Production

Semiconductor Wafer Processing

Doping Techniques

Polysilicon Separation

Heteroepitaxial Wafer

Crucible Technology

302 patents: Sort by Forward Citations

1. 12503791 - Method of producing epitaxial layer wafers in a chamber of a deposition reactor (2025-12-23),

2. 12497710 - Method for producing semiconductor wafers (2025-12-16),

3. 12480225 - Method for producing silicon semiconductor wafers having low concentrations of pinholes (2025-11-25),

4. 12479129 - Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes (2025-11-25),

5. 12479128 - Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon (2025-11-25),

6. 12437989 - Method for depositing a silicon germanium layer on a substrate (2025-10-07),

7. 12381074 - Method, control system, and system for machining a semiconductor wafer, and semiconductor wafer (2025-08-05),

8. 12378693 - Crystal piece of monocrystalline silicon (2025-08-05),

9. 12378692 - Semiconductor wafer made of single-crystal silicon and process for the production thereof (2025-08-05),

10. 12359342 - Method for pulling a single crystal of silicon in accordance with the Czochralski method (2025-07-15),

11. 12331424 - Method for depositing an epitaxial layer on a substrate wafer (2025-06-17),

12. 12325081 - Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes (2025-06-10),

13. 12313578 - Method for producing semiconductor wafers (2025-05-27),

14. 12311577 - Method and apparatus for simultaneously slicing a multiplicity of slices from a workpiece (2025-05-27),

15. 12311455 - Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes (2025-05-27),

SILTRONIC AG is a leading global manufacturer of hyperpure silicon wafers and a partner to many top chip manufacturers. With headquarters in Munich, Germany, SILTRONIC AG has production sites and sales offices located in Europe, Asia, and the United States. The company's high-quality silicon wafers are used in various applications, including semiconductors, memory chips, and power electronics. SILTRONIC AG is committed to delivering innovative and sustainable solutions to meet the growing demand for advanced semiconductor technologies.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

302 Patents

#25 in W-8000 Munich

#217 in Germany

#2,873 in the World

Munich, Germany

Siltronic Ag

Forward Citations = 527

298 inventors:

Wilfried Von Ammon (30 out of 36 patents)

Georg Pietsch (22 out of 24 patents)

Juergen Schwandner (21 out of 21 patents)

4. Reinhold Wahlich (18 out of 20 patents)

5. Katsuhiko Nakai (16 out of 16 patents)

Please report any incorrect information to support@idiyas.com

Loading…