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For the Inventor, By the Inventor

Munich, Germany

Siltronic Ag


USPTO Granted Patents = 317

% Expired Patents = 24.0


Trademarks = 4

Forward Citations = 540

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310 inventors (with patents filed for the assignee):

goldMedal Wilfried Von Ammon (30 out of 36 patents)

silverMedal Georg Pietsch (24 out of 26 patents)

bronzeMedal Juergen Schwandner (21 out of 21 patents)

4.  Reinhold Wahlich (18 out of 20 patents)

5.  Katsuhiko Nakai (16 out of 16 patents)

6.  Reinhard Schauer (15 out of 18 patents)

7.  Thomas Buschhardt (14 out of 17 patents)

8.  Martin Weber (14 out of 26 patents)

9.  Michael Kerstan (13 out of 14 patents)

10.  Peter Wiesner (13 out of 13 patents)

11.  Timo Mueller (12 out of 12 patents)

12.  Peter Storck (12 out of 13 patents)

13.  Teruo Haibara (11 out of 12 patents)

14.  Brian Murphy (11 out of 11 patents)

15.  Andreas Sattler (10 out of 10 patents)


Core Competencies:
Epitaxial Layer
Silicon Wafer
Single Crystal
Monocrystalline
Wire Saw
Doping
Semiconductor Substrate
Crystal Growth
Polishing
Vapor Deposition
Cleaning Method
Classification

317 patents:

1. 12729441 - Method and device for depositing an epitaxial layer on a substrate wafer made of semiconductor material (2026-09-08),
2. 12716652 - Device for drying semiconductor substrates (2026-08-25),
3. 12692621 - Method for depositing an epitaxial layer on a substrate wafer made of semiconductor material in a deposition device (2026-07-28),
4. 12680189 - Process for manufacturing a monocrystalline silicon semiconductor wafer, and monocrystalline silicon semiconductor wafer (2026-07-14),
5. 12662751 - Process for manufacturing semiconductor wafers containing a gas-phase epitaxial layer in a deposition chamber (2026-06-23),
6. 12637786 - Method for producing a gallium oxide layer on a substrate (2026-05-26),
7. 12635445 - Device for drying semiconductor substrates (2026-05-19),
8. 12635442 - Method for cleaning a semiconductor wafer (2026-05-19),
9. 12598938 - Device for drying semiconductor substrates (2026-04-07),
10. 12596062 - Method for classifying unknown particles on a surface of a semi-conductor wafer (2026-04-07),
11. 12558731 - Method for separating multiple slices of workpieces by means of a wire saw during a sequence of separation processes (2026-02-24),
12. 12553145 - Apparatus and method for producing a doped monocrystalline rod made of silicon (2026-02-17),
13. 12550680 - Method for testing the stress robustness of a semiconductor substrate (2026-02-10),
14. 12532714 - Method for producing discs from a cylindrical rod made of a semiconductor material (2026-01-20),
15. 12532700 - Method for depositing an epitaxial layer on a substrate wafer (2026-01-20),
SILTRONIC AG is a leading global manufacturer of hyperpure silicon wafers and a partner to many top chip manufacturers. With headquarters in Munich, Germany, SILTRONIC AG has production sites and sales offices located in Europe, Asia, and the United States. The company's high-quality silicon wafers are used in various applications, including semiconductors, memory chips, and power electronics. SILTRONIC AG is committed to delivering innovative and sustainable solutions to meet the growing demand for advanced semiconductor technologies.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Sep 15 2026

Siltronic Ag
317 Patents

#24 in W-8000 Munich

#185 in Germany

#2,825 in the World

Munich, DE
Munich, Germany

Siltronic Ag

Forward Citations = 540

310 inventors:

goldMedal Wilfried Von Ammon (30 out of 36 patents)

silverMedal Georg Pietsch (24 out of 26 patents)

bronzeMedal Juergen Schwandner (21 out of 21 patents)

4.  Reinhold Wahlich (18 out of 20 patents)

5.  Katsuhiko Nakai (16 out of 16 patents)

Please report any incorrect information to [email protected]
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