The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Oct. 28, 2022
Applicant:

Siltronic Ag, Munich, DE;

Inventors:

Damian Brock, Sankt Wolfgang, DE;

Albert Kuehnstetter, Burghausen, DE;

Assignee:

SILTRONIC AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 70/00 (2026.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 70/18 (2026.01); H10P 72/0414 (2026.01);
Abstract

A side of a semiconductor wafer is cleaned in the following order: (1) executing a first cleaning step, cleaning with ozonized water, and a subsequent rinsing step, rinsing with purified water; (2) executing a second cleaning step, which includes, executing a first treatment step, including treating with ozonized water, which is followed by executing a second treatment step, treating with a hydrogen fluoride (HF)-containing liquid, where the second cleaning step may be repeated multiply; (3) executing a third cleaning step, cleaning with ozonized water, and executing a subsequent rinsing step, rinsing with purified water; and (4) executing a drying step. A preliminary cleaning step, which includes cleaning the side of the semiconductor with water, is executed directly before the first cleaning step so that the side of the semiconductor wafer is still wet while the first cleaning step commences.


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