logo

For the Inventor, By the Inventor

Burghausen, Germany

Georg Pietsch

USPTO Granted Patents = 24 

 

Average Co-Inventor Count = 1.6

ph-index = 5

Forward Citations = 65(Granted Patents)


Company Filing History:

goldMedal22 out of 300 
 
Siltronic Ag
 patents
silverMedal4 out of 7 
 
Peter Wolters Gmbh
 patents
bronzeMedal2 out of 42 
 
Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag
 patents
where one patent can have more than one assignee

Years Active: 1999-2025

Loading Chart...
Loading Chart...
24 patents (USPTO):Explore Patents
1. 12311577 - Method and apparatus for simultaneously slicing a multiplicity of slices from a workpiece (2025-05-27),
2. 11878359 - Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot (2024-01-23),
3. 9573296 - Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece (2017-02-21),
4. 9539695 - Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers (2017-01-10),
5. 9346188 - Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece (2016-05-24),
6. 9333673 - Method for simultaneously cutting a multiplicity of wafers from a workpiece (2016-05-10),
7. 9199791 - Device and method for buffer-storing a multiplicity of wafer-type workpieces (2015-12-01),
8. 9011209 - Method and apparatus for trimming the working layers of a double-side grinding apparatus (2015-04-21),
9. 8986070 - Method for trimming the working layers of a double-side grinding apparatus (2015-03-24),
10. 8974267 - Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers (2015-03-10),
11. 8911281 - Method for trimming the working layers of a double-side grinding apparatus (2014-12-16),
12. 8851958 - Method for the simultaneous double-side material-removing processing of at least three workpieces (2014-10-07),
13. 8801500 - Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers (2014-08-12),
14. 8795776 - Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus (2014-08-05),
15. 8685270 - Method for producing a semiconductor wafer (2014-04-01),

Title: The Innovative Mind of Georg Pietsch

Introduction: Georg Pietsch, a visionary inventor hailing from Burghausen, Germany, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Georg Pietsch holds several patents in the areas of renewable energy technologies, advanced materials, and sustainable manufacturing processes. His most recent patent focuses on a revolutionary method for harnessing solar energy more efficiently.

Career Highlights: With a career spanning over two decades, Georg Pietsch has worked for leading tech companies, where he spearheaded research and development projects that have led to significant technological advancements. His expertise in translating ideas into practical solutions has earned him recognition in the industry.

Collaborations: Throughout his career, Georg Pietsch has collaborated with top researchers, engineers, and scientists from around the world. His ability to work in multidisciplinary teams has resulted in the successful development of cutting-edge technologies that have the potential to shape the future.

Conclusion: Georg Pietsch's relentless pursuit of innovation and his passion for creating sustainable solutions have established him as a key figure in the world of technology. His work continues to inspire the next generation of inventors and researchers to push the boundaries of what is possible in the realm of innovation.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…