The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Jan. 30, 2018
Applicant:

Siltronic Ag, Munich, DE;

Inventor:

Georg Pietsch, Burghausen, DE;

Assignee:

Siltronic AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23D 57/00 (2006.01); B23D 61/18 (2006.01); B28D 5/04 (2006.01);
U.S. Cl.
CPC ...
B23D 57/0061 (2013.01); B23D 57/0053 (2013.01); B23D 61/185 (2013.01); B28D 5/045 (2013.01);
Abstract

A multiplicity of wafers are simultaneously cut from an ingot using a structured sawing wire having indentations and protrusions along its length, wherein the structured sawing wire is guided through grooves of two wire guide rolls, and a bottom of each groove, on which the structured wire bears, has a curved groove bottom with a radius of curvature which, for each groove, is equal to or up to 1.5 times as large as the radius of the envelope of the structured wire which the structured wire has in the respective groove.


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Pietsch, Georg. (2024). Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot (U.S. Patent No. 11878359). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11878359

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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