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Burghausen, Germany

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

USPTO Granted Patents = 42

Forward Citations = 301

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84 inventors (with patents filed for the assignee):

Wilfried Von Ammon (9 out of 14 patents)

Erich Dornberger (6 out of 12 patents)

Karl Egglhuber (5 out of 9 patents)

4. Hans Olkrug (4 out of 4 patents)

5. Holger Lundt (3 out of 6 patents)

6. Hanifi Malcok (3 out of 5 patents)

7. Thomas Buschhardt (2 out of 17 patents)

8. Georg Pietsch (2 out of 24 patents)

9. Maximilian Kaeser (2 out of 3 patents)

10. Erich Tomzig (2 out of 9 patents)

11. Reinhold Wahlich (2 out of 20 patents)

12. Wilfried Von Ammon (2 out of 36 patents)

13. Theresia Bauer (2 out of 5 patents)

14. Manfred Thurner (2 out of 3 patents)

15. Ernst Feuchtinger (2 out of 4 patents)

Core Competencies:

Single Crystal Production

Semiconductor Wafers

Polishing Processes

Wire Saw Technology

Crystal Growth Control

Chemical Treatment of Wafers

Surface Smoothness Examination

Silicon Melt Oxygen Measurement

Monocrystal Pulling Methods

Defect Reduction in Semiconductors

Wafer Holder Design

Material-Abrading Machining

42 patents: Sort by Forward Citations

1. 7011704 - Method and device for the production of a single crystal (2006-03-14),

2. 6645862 - Double-side polishing process with reduced scratch rate and device for carrying out the process (2003-11-11),

3. 6640796 - Method for separating slices from a hard brittle workpiece, and wire saw for carrying out the method (2003-11-04),

4. 6579589 - Semiconductor wafer with crystal lattice defects, and process for producing this semiconductor wafer (2003-06-17),

5. 6554686 - Sawing wire and method for the cutting and lapping of hard brittle workpieces (2003-04-29),

6. 6461582 - Single-crystal rod and process for its production (2002-10-08),

7. 6451124 - Process for the chemical treatment of semiconductor wafers (2002-09-17),

8. 6159284 - Process and device for producing a cylindrical single crystal and (2000-12-12),

9. 6153008 - Device and method for pulling a single crystal (2000-11-28),

10. 6132507 - Process and device for the production of a single crystal (2000-10-17),

11. 6129609 - Method for achieving a wear performance which is as linear as possible (2000-10-10),

12. 6128073 - Device and method for examining the smoothness of a sample surface (2000-10-03),

13. 6117776 - Wafer holder and method of producing a semiconductor wafer (2000-09-12),

14. 6117230 - Process for producing a silicon single crystal, and heater for carrying (2000-09-12),

15. 6098610 - Wire saw and method of using it (2000-08-08),

Wacker Siltronic Gesellschaft Für Halbleitermaterialien AG is a leading global manufacturer of hyperpure silicon wafers used in the semiconductor industry. With production sites and offices worldwide, the company possesses a strong market position and operates state-of-the-art facilities. Sitrionic focuses on delivering high-quality products and innovative solutions to its customers, ensuring their competitive edge in the fast-evolving semiconductor market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

42 Patents

#2 in

#1,250 in Germany

#15,852 in the World

Burghausen, Germany

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Forward Citations = 301

84 inventors:

Wilfried Von Ammon (9 out of 14 patents)

Erich Dornberger (6 out of 12 patents)

Karl Egglhuber (5 out of 9 patents)

4. Hans Olkrug (4 out of 4 patents)

5. Holger Lundt (3 out of 6 patents)

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