Company Filing History:
3 out of 42 
1 out of 302 
2 out of 832,891 Years Active: 1998-2004
Title: Holger Lundt: A Pioneer in Semiconductor Innovations
Introduction
Holger Lundt is a notable inventor based in Burghausen, Germany, recognized for his impactful contributions to the field of semiconductor technology. With a total of six patents to his name, Lundt's work exemplifies innovation in methods and devices that enhance the performance and capabilities of semiconductor materials.
Latest Patents
Lundt's latest patents showcase his expertise in advanced cutting techniques and defect detection methods. One of his key inventions is a "Method for cutting slices from a workpiece," which involves cutting a rod or block-shaped workpiece using a saw while monitoring its temperature. This control mechanism ensures the workpiece's temperature is effectively managed during the cutting process, thereby enhancing precision and quality. Another significant patent is the "Method and device for nondestructive detection of crystal defects," which employs a sophisticated combination of photoluminescence heterodyne spectroscopy, photothermal heterodyne spectroscopy, and spatially resolved infrared detection (SIRD) to identify and characterize crystal defects in monocrystalline semiconductor materials.
Career Highlights
Lundt has had a remarkable career, working in reputable companies such as Wacker Siltronic, a leading provider of semiconductor materials. His tenure in such prestigious organizations has enabled him to refine his skills and contribute to groundbreaking innovations that address the challenges faced in the semiconductor industry.
Collaborations
Throughout his career, Lundt has collaborated with esteemed colleagues, including Bert Ripper and Christian Andrae. These collaborations have played a crucial role in facilitating the exchange of ideas and fostering innovation within the semiconductor community.
Conclusion
Holger Lundt stands out as a skilled inventor whose patents significantly advance the semiconductor field. His dedication to developing innovative cutting methods and defect detection techniques continues to impact the industry positively, paving the way for future advancements.