The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2001
Filed:
Dec. 08, 1998
Applicant:
Inventors:
Robert Rurlaender, Halsbach, DE;
Norbert Franze, Burgkirchen, DE;
Franz Mangs, Tittmoning, DE;
Anton Schnegg, Burghausen, DE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J / ; C09J / ; C09J 1/04 ;
U.S. Cl.
CPC ...
C09J / ; C09J / ; C09J 1/04 ;
Abstract
A method of mounting and demounting a semiconductor wafer, in which a temperature dependent adhesive and curable joint is provided by an adhesive mixture between the semiconductor wafer and a carrier plate. The adhesive mixture contains a colophonium resin which is chemically modified and esterified. The cured joint is released with water again after polishing the semiconductor wafer. The adhesive mixture suitable for carrying out the method is this resin with an amine which saponifies the resin.