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For the Inventor, By the Inventor

Fremont, CA, United States of America

Silicon Genesis Corporation


USPTO Granted Patents = 149


Trademarks = 1

Forward Citations = 8,294

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36 inventors (with patents filed for the assignee):

goldMedal Francois J Henley (107 out of 149 patents)

silverMedal Nathan W Cheung (53 out of 59 patents)

bronzeMedal Igor J Malik (17 out of 19 patents)

4.  Sien G Kang (12 out of 15 patents)

5.  Harry Robert Kirk (11 out of 11 patents)

6.  Philip James Ong (11 out of 11 patents)

7.  Michael I Current (10 out of 15 patents)

8.  Michael A Bryan (10 out of 28 patents)

9.  Theodore E Fong (9 out of 9 patents)

10.  Chung M Chan (9 out of 30 patents)

11.  Paul K Chu (6 out of 7 patents)

12.  William George En (5 out of 68 patents)

13.  James Andrew Sullivan (4 out of 6 patents)

14.  Sharon N Farrens (4 out of 4 patents)

15.  James K Kai (4 out of 153 patents)


Core Competencies:
Semiconductor Devices
Three Dimensional Integrated Circuits
Layer Transfer Techniques
Silicon Ingots
Optoelectronic Devices
Solar Cell Fabrication
Controlled Cleaving Processes
Thin Film Formation
Strained Silicon
Wafering Techniques
Temperature Control
Implantation Processes

149 patents:

1. 12176326 - Method of forming semiconductor device using high stress cleave plane (2024-12-24),
2. 11901351 - Three dimensional integrated circuit with lateral connection layer (2024-02-13),
3. 11626392 - Method of forming semiconductor device using range compensating material (2023-04-11),
4. 11444221 - Layer transfer of films utilizing controlled shear region (2022-09-13),
5. 11410984 - Three dimensional integrated circuit with lateral connection layer (2022-08-09),
6. 10923459 - Three dimensional integrated circuit (2021-02-16),
7. 10804252 - Three dimensional integrated circuit (2020-10-13),
8. 10683588 - Shaped silicon ingot using layer transfer (2020-06-16),
9. 10573627 - Three dimensional integrated circuit (2020-02-25),
10. 10087551 - Method and device for slicing a shaped silicon ingot using layer transfer (2018-10-02),
11. 10049915 - Three dimensional integrated circuit (2018-08-14),
12. 9704835 - Three dimensional integrated circuit (2017-07-11),
13. 9640711 - Substrate cleaving under controlled stress conditions (2017-05-02),
14. 9460908 - Method and device for slicing a shaped silicon ingot using layer transfer (2016-10-04),
15. 9362439 - Layer transfer of films utilizing controlled shear region (2016-06-07),
Silicon Genesis Corporation (SiGen) is a leading provider of wafer separation and thinning solutions for the semiconductor industry. SiGen's patented technologies enable the fabrication of thinner, more flexible, and higher-performing semiconductor wafers. Their innovative solutions have been adopted by leading chip manufacturers worldwide to enable the production of advanced devices such as smartphones, tablets, and wearables. SiGen's commitment to continuous innovation and customer satisfaction has made them a trusted partner in the semiconductor industry.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 9 2025

149 Patents

#18 in Fremont, CA

#587 in California

#2,550 in US

#5,331 in the World

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Fremont, CA, United States of America

Silicon Genesis Corporation

Forward Citations = 8,294

36 inventors:

goldMedal Francois J Henley (107 out of 149 patents)

silverMedal Nathan W Cheung (53 out of 59 patents)

bronzeMedal Igor J Malik (17 out of 19 patents)

4.  Sien G Kang (12 out of 15 patents)

5.  Harry Robert Kirk (11 out of 11 patents)

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