The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Feb. 14, 2020
Applicant:

Silicon Genesis Corporation, Fremont, CA (US);

Inventors:

Theodore E. Fong, Pleasanton, CA (US);

Michael I. Current, San Jose, CA (US);

Assignee:

Silicon Genesis Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 25/10 (2006.01); H01L 21/822 (2006.01); H01L 25/00 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 21/76254 (2013.01); H01L 21/8221 (2013.01); H01L 25/50 (2013.01); H01L 27/0688 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method of forming a device includes providing a first substrate having a first area and a second area, forming a range compensating material over the first substrate so that the first material is disposed over the first area and not disposed over the second area, implanting ions into the first area and the second area to form first and second cleave planes at first and second depths, respectively, each of the first and second cleave planes being defined by a concentration of the implanted ions, removing the range compensating material, and cleaving the first substrate along a cleave profile including the first and second cleave planes.


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