The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Dec. 01, 2017
Applicant:

Silicon Genesis Corporation, Santa Clara, CA (US);

Inventors:

Theodore E. Fong, Pleasanton, CA (US);

Michael I. Current, San Jose, CA (US);

Assignee:

SILICON GENESIS CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/822 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); H01L 21/8221 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 27/0688 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A stacked semiconductor device is formed by implanting ions through dielectric and conductive structures of a first substrate to define a cleave plane in the first substrate, cleaving the first substrate at the cleave plane to obtain a cleaved layer including the dielectric and conductive structures, bonding at least one die to the first substrate, the at least one die having a smaller width than a width of the first substrate, depositing a planarization material over the at least one die, planarizing the planarization material to form a planarized upper surface over the at least one die, and stacking a third substrate on the planarized upper surface.


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