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Ryoden Semiconductor System Engineering Corporation

USPTO Granted Patents = 52

% Expired Patents = 1.9

Forward Citations = 801

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113 inventors (with patents filed for the assignee):

Tadashi Nishioka (13 out of 33 patents)

Shigenobu Maeda (5 out of 206 patents)

Hisayuki Nishimura (5 out of 5 patents)

4. Toshikazu Tsutsui (4 out of 5 patents)

5. Nobuaki Doi (4 out of 4 patents)

6. Masaaki Furuta (4 out of 4 patents)

7. Takao Yasue (4 out of 23 patents)

8. Kouichirou Tsutahara (4 out of 9 patents)

9. Takayuki Suenaga (4 out of 4 patents)

10. Tooru Yamaguchi (4 out of 4 patents)

11. Hiroshi Tanaka (4 out of 19 patents)

12. Shigeto Maegawa (3 out of 71 patents)

13. Itaru Kanno (3 out of 18 patents)

14. Takeshi Kuroda (3 out of 5 patents)

15. Satoru Kawazu (3 out of 5 patents)

Core Competencies:

Semiconductor Memory Device

Thin-Film Transistor

Power Module

Failure Analysis

Drying Apparatus

Washing Method

Plasma Apparatus

Photoresist Coating

Field Effect Transistor

Contamination Evaluating

Liquid Vaporizing Apparatus

Semiconductor Wafer Inspection

52 patents: Sort by Forward Citations

1. 6993696 - Semiconductor memory device with built-in self test circuit operating at high rate (2006-01-31),

2. 6934648 - Jitter measurement circuit for measuring jitter of measurement target signal on the basis of sampling data string obtained by using ideal cyclic signal (2005-08-23),

3. 6900986 - Power module (2005-05-31),

4. 6864580 - Semiconductor device and method of manufacturing the same (2005-03-08),

5. 6841487 - Method of manufacturing semiconductor device and flash memory (2005-01-11),

6. 6110834 - Semiconductor device and manufacturing method thereof for removing (2000-08-29),

7. 6103556 - Thin-film transistor and method of manufacturing the same (2000-08-15),

8. 6101737 - Apparatus and method for drying a semiconductor member (2000-08-15),

9. 6048409 - Washing apparatus and washing method (2000-04-11),

10. 6046488 - Semiconductor device having conductive layer and manufacturing method (2000-04-04),

11. 6032382 - Drying apparatus and method using IPA of a semiconductor wafer (2000-03-07),

12. 6027962 - Method of manufacturing semiconductor device having bipolar transistor (2000-02-22),

13. 6016278 - Failure analysis method and device (2000-01-18),

14. 6009545 - System for analyzing a failure in a semiconductor wafer by calculating (1999-12-28),

15. 6005289 - Package for semiconductor device laminated printed circuit boards (1999-12-21),

Ryoden Semiconductor System Engineering Corporation, based in Hyogo, Japan, specializes in the semiconductor manufacturing sector. The company focuses on developing advanced technologies related to semiconductor memory devices, thin-film transistors, and power modules. Additionally, Ryoden is engaged in failure analysis and offers innovative solutions in drying apparatus, washing methods, plasma apparatus, and photoresist coating. Their expertise supports the evolving needs of the semiconductor industry, contributing to enhanced manufacturing processes and product reliability.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

52 Patents

#26 in Hyogo

#1,669 in Japan

#13,545 in the World

Ryoden Semiconductor System Engineering Corporation

Forward Citations = 801

113 inventors:

Tadashi Nishioka (13 out of 33 patents)

Shigenobu Maeda (5 out of 206 patents)

Hisayuki Nishimura (5 out of 5 patents)

4. Toshikazu Tsutsui (4 out of 5 patents)

5. Nobuaki Doi (4 out of 4 patents)

Please report any incorrect information to [email protected]

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