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Ryoden Semiconductor System Engineering Corporation

USPTO Granted Patents = 52

Forward Citations = 795

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113 inventors (with patents filed for the assignee):

Tadashi Nishioka (13 out of 33 patents)

Shigenobu Maeda (5 out of 206 patents)

Hisayuki Nishimura (5 out of 5 patents)

4. Toshikazu Tsutsui (4 out of 5 patents)

5. Nobuaki Doi (4 out of 4 patents)

6. Masaaki Furuta (4 out of 4 patents)

7. Takao Yasue (4 out of 23 patents)

8. Kouichirou Tsutahara (4 out of 9 patents)

9. Takayuki Suenaga (4 out of 4 patents)

10. Tooru Yamaguchi (4 out of 4 patents)

11. Hiroshi Tanaka (4 out of 19 patents)

12. Shigeto Maegawa (3 out of 71 patents)

13. Itaru Kanno (3 out of 17 patents)

14. Takeshi Kuroda (3 out of 5 patents)

15. Satoru Kawazu (3 out of 5 patents)

Core Competencies:

Semiconductor Memory Device

Jitter Measurement Circuit

Power Module

Thin-Film Transistor

Failure Analysis Method

Drying Apparatus

Photoresist Coating Apparatus

Flip Chip Semiconductor Device

Atomic Force Microscope

Field Effect Thin-Film Transistor

Liquid Vaporizing Apparatus

Contamination Evaluating Apparatus

52 patents: Sort by Forward Citations

1. 6993696 - Semiconductor memory device with built-in self test circuit operating at high rate (2006-01-31),

2. 6934648 - Jitter measurement circuit for measuring jitter of measurement target signal on the basis of sampling data string obtained by using ideal cyclic signal (2005-08-23),

3. 6900986 - Power module (2005-05-31),

4. 6864580 - Semiconductor device and method of manufacturing the same (2005-03-08),

5. 6841487 - Method of manufacturing semiconductor device and flash memory (2005-01-11),

6. 6110834 - Semiconductor device and manufacturing method thereof for removing (2000-08-29),

7. 6103556 - Thin-film transistor and method of manufacturing the same (2000-08-15),

8. 6101737 - Apparatus and method for drying a semiconductor member (2000-08-15),

9. 6048409 - Washing apparatus and washing method (2000-04-11),

10. 6046488 - Semiconductor device having conductive layer and manufacturing method (2000-04-04),

11. 6032382 - Drying apparatus and method using IPA of a semiconductor wafer (2000-03-07),

12. 6027962 - Method of manufacturing semiconductor device having bipolar transistor (2000-02-22),

13. 6016278 - Failure analysis method and device (2000-01-18),

14. 6009545 - System for analyzing a failure in a semiconductor wafer by calculating (1999-12-28),

15. 6005289 - Package for semiconductor device laminated printed circuit boards (1999-12-21),

Ryoden Semiconductor System Engineering Corporation is a leading provider of advanced testing solutions for the semiconductor industry. With expertise in test systems and services, we cater to the evolving needs of the semiconductor market. Our comprehensive range of products includes wafer probing systems, test handlers, and thermal management solutions. We strive to deliver high-quality and efficient solutions to enable semiconductor manufacturers to improve testing efficiency and yield. Visit our website for more information and to explore our offerings.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

52 Patents

#25 in Hyogo

#1,634 in Japan

#13,152 in the World

Ryoden Semiconductor System Engineering Corporation

Forward Citations = 795

113 inventors:

Tadashi Nishioka (13 out of 33 patents)

Shigenobu Maeda (5 out of 206 patents)

Hisayuki Nishimura (5 out of 5 patents)

4. Toshikazu Tsutsui (4 out of 5 patents)

5. Nobuaki Doi (4 out of 4 patents)

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