The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 1999
Filed:
Oct. 24, 1996
Applicant:
Inventors:
Masaki Watanabe, Tokyo, JP;
Akiyoshi Sawai, Tokyo, JP;
Yoshikazu Narutaki, Tokyo, JP;
Tomoaki Hashimoto, Tokyo, JP;
Masatoshi Yasunaga, Tokyo, JP;
Jun Shibata, Tokyo, JP;
Hiroshi Seki, Tokyo, JP;
Kazuhiko Kurafuchi, Tokyo, JP;
Katsunori Asai, Hyogo, JP;
Assignees:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Ryoden Semiconductor System Engineering Corporation, Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257700 ; 257774 ; 361751 ; 361803 ;
Abstract
The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they are not plated and because only one metal layer is plated on the wiring layers. The narrower wiring layers can be formed easily with small spaces between wires.