IDiyas

For the Inventor, By the Inventor

Tokyo, Japan

Hiroshi Seki

USPTO Granted Patents = 20

 

Average Co-Inventor Count = 3.0

ph-index = 12

Forward Citations = 389(Granted Patents)


Location History:

  • Matsudo-shi, Chiba-ken, JP (1987 - 1992)
  • Itami, JP (1989 - 1994)
  • Kikuchi-gun, JP (1997)
  • Hitachi, JP (1997 - 2001)
  • Ota-Ku, JP (2004)
  • Tokyo, JP (1999 - 2022)

Company Filing History:

goldMedal7 out of 21,351 
 
Mitsubishi Denki Kabushiki Kaisha
 patents
silverMedal5 out of 42,485 
 
Hitachi, Ltd.
 patents
bronzeMedal3 out of 186 
 
Niles Parts Company, Ltd.
 patents
4. 1 out of 52 
 
Ryoden Semiconductor System Engineering Corporation
 patents
5. 1 out of 153 
 
Hitachi-ge Nuclear Energy, Ltd.
 patents
6. 4 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 1987-2022

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20 patents (USPTO):
1. 11378383 - Plant facility apparatus recognition system and plant facility apparatus recognition method (2022-07-05),
2. 10360315 - Construction field management method and construction field management device (2019-07-23),
3. 6911612 - Switch (2005-06-28),
4. 6833517 - Multiple switch device (2004-12-21),
5. 6686550 - Switch (2004-02-03),
6. 6256875 - Method for manufacturing semiconductor device (2001-07-10),
7. 6188388 - Information presentation apparatus and information display apparatus (2001-02-13),
8. 6005289 - Package for semiconductor device laminated printed circuit boards (1999-12-21),
9. 5835078 - Information presentation apparatus and information display apparatus (1998-11-10),
10. 5712658 - Information presentation apparatus and information display apparatus (1998-01-27),
11. 5677993 - Information processing apparatus using pointing input and speech input (1997-10-14),
12. 5672965 - Evaluation board for evaluating electrical characteristics of an IC (1997-09-30),
13. 5309021 - Semiconductor device having particular power distribution (1994-05-03),
14. 5303120 - Method of manufacturing inversion type IC's and IC module using same (1994-04-12),
15. 5157478 - Tape automated bonding packaged semiconductor device incorporating a (1992-10-20),

Title: Hiroshi Seki - Pioneering Inventor from Tokyo

Introduction: Hiroshi Seki is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Hiroshi Seki holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his innovative spirit and forward-thinking approach.

Career Highlights: With over two decades of experience in the industry, Hiroshi Seki has worked with leading research institutions and universities to develop cutting-edge solutions that have revolutionized the way we interact with technology.

Collaborations: Throughout his career, Hiroshi Seki has collaborated with top companies in Japan and internationally, fostering a culture of innovation and pushing the boundaries of what is possible in the world of technology.

Conclusion: Hiroshi Seki's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the field of technology, inspiring the next generation of inventors to push the limits of what is possible.

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