Mitsubishi Denki Kabushiki Kaisha

Hitachi, Ltd.

Other

Niles Parts Company, Ltd.

Hitachi-ge Nuclear Energy, Ltd.

Ryoden Semiconductor System Engineering Corporation

Hiroshi Seki

Tetsuya Ueda

Setsuo Arita

Haruo Shimamoto

Yukiharu Ohga

Koichi Kawaguchi

Jun Shibata

Kazuhiko Kurafuchi

Hideya Yagoura

Akira Kaji

Yukio Nagaoka

Hiroyuki Yuchi

Yasuhiro Teraoka

Masaki Watanabe

Masatoshi Yasunaga

Akiyoshi Sawai

Tomoaki Hashimoto

Katsunori Asai

Yoshikazu Narutaki

Ryuichiro Kataishi

Kazunari Michii

Toshinobu Banjo

Mitsuyuki Takada

Osamu Furukawa

Toru Tachikawa

Hideji Onodera

Satoshi Shimakura

Tsuyoshi Sotome

Yukihiro Murata

Yohei Sugimoto

Hideo Hirai

Kazunari Maeda

Shigeyuki Nango

A plant facility apparatus recognition system is provided, which appropriately recognizes a plant facility apparatus even in a plant facility in which a wireless facility and a marker are not able to be installed even when the shape of the plant facility apparatus is different from or has been changed from design data. The plant facility apparatus recognition system that uses a mobile device having a camera to recognize the plant facility apparatus to be subjected to work in the plant facility includes a characteristic length acquirer that acquires information on the pipe as a first characteristic length from an image obtained by causing the camera to image the plant facility apparatus and the pipe existing near the plant facility apparatus, and a characteristic length comparator that compares the first characteristic length with a second characteristic length acquired from the design data and related to the pipe.

Plant facility apparatus recognition system and plant facility apparatus recognition method

The object is to enable easy acquisition of an element that is not design data. The technique is characterized in that when generating construction field management information used to manage a construction field, a construction field management device acquires measurement data that is three-dimensional shape data measured by a measurement device, and compares design data created by a designer with the acquired measurement data, thus extracting non-design data that is not the design data, from the measurement data. Also, as the non-design data, data of a scaffolding/tool and a component of the design data in a temporarily placed state are extracted, and the status of these is analyzed and displayed on a display unit.

Construction field management method and construction field management device

To provide a switch that can hold a switch knob at neutral and prevent play while reducing a number of parts. In the switch, an operating lever portion of a switch knob is inserted from an opening of a knob attaching portion provided at a switch case and the switching knob is axially supported by the knob attaching portion to be capable of operating to pivot, wherein an elastic pin portion is integrally provided to the switch knob, an engaging hole for engaging the elastic pin portion is provided to a side of the switch case, and when the switch knob is operated to pivot, the switch knob is urged to a neutral portion relative to the knob attaching portion by elastic force by deforming the elastic pin portion to the engaging hole.

Switch

A low cost automotive power window switch having few window operating switches uses a single switch to select which of the four windows to operate, and to control the window locks. The power window switch has a window operating switch for raising and lowering each of the car windows, and a mode selector switch for switching between the windows. The mode selector switch also has a window lock switch function for locking and unlocking the windows.

Multiple switch device

A switch which can widen a degree of freedom of setting height and shape of a click groove while providing a click groove on a side of a movable contact and promote operation feeling without increasing cost. This switch brings a movable contact into contact with a fixed contact and separates the movable contact therefrom by pivoting a movable piece by moving a steel ball on the movable piece by operating a switch knob; wherein the movable piece is provided with a flat click portion having a contact portion and a click groove at an end edge thereof, the click portion being arranged erect relative to a housing; a steel ball contained in a ball support portion via a coil spring; and an opening of the ball support portion provided with a fitting groove to be fitted loosely to the end edge of the click portion of the movable piece.

The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they are not plated and because only one metal layer is plated on the wiring layers. The narrower wiring layers can be formed easily with small spaces between wires.

Method for manufacturing semiconductor device

A pointer remotely points a display screen of a large screen display device. The display screen is picked up by a monitor camera. An image processing unit extracts a feature of the pointer used for pointing based on the resulting image signal to identify the position of the pointing point and the pointer based on the feature. A computer generates information on an object to be displayed at a position pointed by the pointer. The generated information is displayed on a display device (CRT display device or large screen display device) assigned to the pointer. Even when a plurality of pointers are used, the information on the object to be displayed pointed by the pointer is properly displayed.

Information presentation apparatus and information display apparatus

Package for semiconductor device laminated printed circuit boards

Each character string information obtained based on each information inputted by the CRT touch input device and the speech input device respectively is integrated by the input control unit and the memory. The input information analyzing unit analyses the integrated character string information. The output information generating unit generates presentation information corresponding to the demand information obtained by the analysis and outputs this presentation information to the display device. Since the input information from each input device is converted into character string information and it is integrated together and is then analyzed, input information is not restricted by each input device and each input device can be used in a free combination when information is inputted.

Information processing apparatus using pointing input and speech input

An evaluation board for evaluating electrical characteristics of an IC package has an electrically insulating support board having signal wire patterns for contact by a measurement probe formed on a first surface and mounting pads for contact with solder balls of an IC package formed on a surface. The signal wire patterns and the mounting pads are electrically connected with each other via through holes formed in the support board. The signal wire patterns are surrounded by and spaced from a ground pattern formed on the first surface.

Evaluation board for evaluating electrical characteristics of an IC

A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a power supply metal post and a grounding metal post are respectively provided on a power supply lead of a semiconductor chip and grounding lead of the semiconductor chip perpendicular to the leads. The metal posts protrude from the resin encapsulating the chip and are connected to lands or a conductive circuit pattern on a printed circuit board. Furthermore, a planar conductor commonly connecting the power supply or grounding potentials is provided.

Semiconductor device having particular power distribution

A method of manufacturing inversion ICs includes the steps of connecting a first electrode pad group of a semiconductor chip to a second lead group via wires, connecting a second electrode pad group of the semiconductor chip to a first lead group via wires, sealing the semiconductor chip, the first and second lead groups, and the wires in a resin so that the outer lead portions of the leads are exposed, and bending the outer lead portions of the leads toward the bottom surface of the semiconductor chip. An IC module includes a mounting substrate, a standard IC mounted on the top surface of the mounting substrate, an inversion IC mounted on the bottom surface of the mounting substrate so that the leads providing connections to the same functions in the standard and inversion ICs are at the same point on opposite sides of the mounting substrate, and a plurality of connecting members on the mounting substrate, electrically connecting the opposed leads of the standard IC and the leads of the inversion IC together.

Method of manufacturing inversion type IC's and IC module using same

A packaged semiconductor device includes an insulating film having an opening, a semiconductor chip disposed in the opening of the insulating film and having a plurality of electrodes, a plurality of leads, each having one end connected to a corresponding electrode, the plurality of leads being supported on the insulating film, a heat radiator disposed opposite and spaced from the semiconductor chip, and a resin package body encapsulating the semiconductor chip and part of the heat radiator, leaving a surface of the heat radiator externally exposed and the second ends of the plurality of leads extending outwardly from the package.

Tape automated bonding packaged semiconductor device incorporating a

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Tokyo, Japan

Hiroshi Seki