The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Mar. 29, 2004
Nobuyoshi Kimoto, Hyogo, JP;
Takanobu Yoshida, Tokyo, JP;
Naoki Yoshimatsu, Fukuoka, JP;
Masuo Koga, Fukuoka, JP;
Dai Nakajima, Tokyo, JP;
Gourab Majumdar, Tokyo, JP;
Masakazu Fukada, Tokyo, JP;
Nobuyoshi Kimoto, Hyogo, JP;
Takanobu Yoshida, Tokyo, JP;
Naoki Yoshimatsu, Fukuoka, JP;
Masuo Koga, Fukuoka, JP;
Dai Nakajima, Tokyo, JP;
Gourab Majumdar, Tokyo, JP;
Masakazu Fukada, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Ryoden Semiconductor System Engineering Corporation, Itami, JP;
Abstract
A power module includes a first substrate with a power semiconductor device mounted thereon, a second substrate with a control circuit for controlling the power semiconductor device formed thereon, a smoothing capacitor electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device, and a case including a case frame and a case lid. The case has an interior in which the first substrate, the second substrate and the smoothing capacitor are disposed, and the smoothing capacitor is disposed in contact with a side surface of the case frame.