Tokyo, Japan

Takanobu Yoshida


Average Co-Inventor Count = 3.1

ph-index = 11

Forward Citations = 329(Granted Patents)


Location History:

  • Hyogo, JP (2002)
  • Fukuoka, JP (2003 - 2006)
  • Tokyo, JP (2001 - 2010)

Company Filing History:


Years Active: 2001-2010

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13 patents (USPTO):Explore Patents

Title: Takanobu Yoshida: Innovator in Power Semiconductor Technology

Introduction

Takanobu Yoshida is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of power semiconductor devices, holding a total of 13 patents. His innovative designs have advanced the efficiency and effectiveness of power semiconductor technology.

Latest Patents

Yoshida's latest patents include a power semiconductor device that features at least one pair of power modules. Each module has a molding surface covered with molding resin and a radiating surface opposite to the molding surface. The design incorporates a pair of radiating fins that sandwich the power modules, ensuring optimal contact between the molding surfaces and the radiating fins. Another notable patent is for a power semiconductor module that arranges multiple power semiconductor chips, separated by a terminal board. This design enhances heat dissipation, ensuring that the power semiconductor devices operate efficiently.

Career Highlights

Throughout his career, Takanobu Yoshida has worked with Mitsubishi Electric Corporation, where he has contributed to various projects in power semiconductor technology. His work has been instrumental in developing devices that improve energy efficiency and thermal management.

Collaborations

Yoshida has collaborated with notable colleagues such as Naoki Yoshimatsu and Toshiaki Shinohara. Their combined expertise has fostered innovation in the semiconductor industry.

Conclusion

Takanobu Yoshida's contributions to power semiconductor technology have established him as a leading inventor in his field. His innovative patents and collaborations continue to influence advancements in energy efficiency and device performance.

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