The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2001
Filed:
Sep. 18, 2000
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A resin-sealed power semiconductor device is provided. The thicknesses of a die pad (,) and a lead part (,) are made equal and as great as possible. A thick film substrate (,) is bonded with a bonding layer (,) onto a plurality of supporting inner leads (,AS) among first inner leads (,A,) positioned above the die pad (,). Patterns of a control circuit of power semiconductor elements (,) are formed as thick film patterns (,) on an upper surface of the substrate (,), and a control circuit element (IC) (,) and all electronic components (,) are mounted on the patterns (,) by soldering. The constituents (,A,B,) are sealed in a sealing resin (,). The resin-sealed power semiconductor device improves noise immunity while conventionally effectively dissipating heat generated by the power semiconductor elements, and is designed to be adaptable to increase in functionality thereof.